Wafer level packaging of MEMS

TRANSDUCERS 2009 - 15th International Conference on Solid-State Sensors, Actuators and Microsystems

Volumn , Issue , 2009, Pages 9-16

  Esashi, M ^a  

^a TOHOKU UNIVERSITY   (Japan)

Author keywords

Bonding; MEMS; Wafer level packaging

Indexed keywords

ELECTRICAL INTERCONNECTIONS; MEMS-STRUCTURE; SILICON CHIP; VACUUM PACKAGING; WAFER LEVEL PACKAGING;

ACTUATORS; COST REDUCTION; MEMS; MICROELECTROMECHANICAL DEVICES; MICROMACHINING; MICROSYSTEMS; PACKAGING; PIEZOELECTRIC TRANSDUCERS; SILICON WAFERS; SOLID-STATE SENSORS; WAFER BONDING;

ELECTRONICS PACKAGING;

EID: 71449103977     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/SENSOR.2009.5285574     Document Type: Conference Paper

References (23)

1. M. Esashi, "Encapsulated Micro Mechanical Sensors", Microsystem Technologies vol.1, pp.2-9, 1994.
2. M. Esashi, "Wafer Level Packaging of MEMS", J. of Micromechanics and Microeng., vol.18, 073001(13pp), 2008.
3. T. Kudoh, S. Shoji, M. Esashi, "An Integrated Miniature Capacitive Pressure Sensor", Sensors and Actuators A, no.29, pp.185-193, 1991.
4. M. Shirai, M. Esashi, "Circuit Damage by Anodic Bonding", Sensor Technical Report, Institute of Electrical Engineers in Japan, Tokyo, Nov.27, 1992, pp.9-17 (in Japanese).
5. M. Esashi, "Micromachining for Packaged Sensors", Digest Tech. Papers Transducers'93, Yokohama, June 7-10, 1993, pp.260-265.
6. S. Ko, D. Sim, M. Esashi, "An Electrostatic Servo-accelerometer with mG Resolution", Trans. IEEJ, vol.119-E, pp.368-373, 1999.
7. K. Nakamura, F. Takayanagi, Y. Moro, H. Sanpei, M. Onozawa, M. Esashi, "Development of RF MEMS Switch", Advantest Technical Report, vol.22, pp.9-16, 2004 (in Japanese).
8. T. Abe, X. Li, M. Esashi, "Endpoint Detectable Plating through Femtosecond Laser Drilled Glass Wafers for Electrical Interconnections", Sensors and Actuators A, no.108, pp.234-238, 2003.
9. X. Li, T. Abe, M. Esashi, "An Integrated Encapsulating Technology with High-density Plated-through-holes in Pyrex Glass", ICEE 2004/APCOT MNT 2004, Sapporo, July 4-8, 2004, pp.634-637.
10. M. Mohri, A. Okada, H. Fukushi, S. Tanaka, M. Esashi, "Hermetic Seal using Anodically-bondable LTCC Substrate", 23th Convention of Japan Inst. of Electronic Packaging, Yokohama, March 11, 2009, pp.51-52 (in Japanese).
11. R. C. Ruby, A. Barfknecht, C. Han, Y. Desai, F. Geefay, G. Gan, M. Gat, T. Verhoeven, "High-Q FBAR Filters in a Wafer-level Chip-scale Package", 2002 IEEE Internl. Solid-State Circuit Conf., San Francisco, Feb. 6, 2002, pp.184-185.
12. M. Esashi, N. Ura, Y. Matsumoto, "Anodic Bonding for Integrated Capacitive Sensors", Proceedings Micro Electro Mechanical Systems'92, Travemunde, Feb.4-7, 1992, pp.43-48.
13. M. W. Judy, "Evolution of Integrated Inertial MEMS Technology", Technical Digest Solid-State Sensors Actuator and Microsystems Workshop, pp.27-32, Hilton Head, June 6-10, 2004.
14. S. S. Nasiri, A. F. Flannery Jr., "Method of Fabrication of Al/Ge Bonding in a Wafer Packaging Environment and a Product Produced Therefrom", Internl. patent W0 2006/101769, 2005.
15. A. Parridge, M. Lutz, B. Kim, M. Hopcroft, R. N. Candler, T. W. Kenny, K. Petersen, M. Esashi, "MEMS Resonators: Getting the Packaging Right", The 9th SEMI Microsystem/MEMS Seminor, Makuhari, pp.55-58, Dec.7, 2005.
16. M. A. Lagos, A. Arias, J. M. Hinojosa, J. Spengler, C. Leinenbach, T. Fuchs, S. Kronmuller, "Processing of MEMS Gyroscope on Top of CMOS ICs," 2005 IEEE Internl. Solid-State Circuit Conf., San Francisco, pp.88-89, Feb. 7, 2005.
17. R. He, C. J. Kim, "On-wafer Monolithic Encapsulation by Surface Micromachining with Porous Polysilicon Shell," J. of Micro- electromechanical Systems, vol.16, pp.462-472, 2007.
18. H. Henmi, S. Shoji, Y. Shoji, K. Yoshimi, M. Esashi, "Vacuum Packaging for Micro-sensors by Glass-silicon Anodic Bonding," Sensors and Actuators A, no.43, pp.243-248, 1994.
19. H. Miyashita, Y. Kitamura, "Micromachined Capacitive Diaphragm Gauge", Anelva Technical Report, vol.11, pp.37-41, 2005 (in Japanese).
20. K. Fukatsu, T. Murakoshi, M. Esashi, "Electrostatically Levitated Micro Motor for Inertia Measurement System", Digest Tech. Papers Transducers'99, Sendai, pp.1558-1561, June 7-10, 1999
21. K. Ikeda, H. Kuwayama, T. Kobayashi, T. Watanabe, T. Nishikawa, T. Yoshida, "Silicon Pressure Sensor with Resonant Strain Gages Built into Diaphragm", 7th Sensor Symposium, Tokyo, pp.55-58, May 30-31, 1988.
22. K. Minami, T. Moriuchi, M. Esashi,, "Cavity Pressure Control for Critical Dumping of Packaged Micro Mechanical Devices", Digest of Technical Papers Transducers'95, Stockholm, pp.240-243, June 25-29, 1995.
23. S. N. Farrens, J. R. Dekker, J. K. Smith, B. E. Roberds, "Chemical Free Room Temperature Wafer to Wafer Direct Bonding", J. Electrochem. Soc., vol.142, pp.3949-3955, 1995.