EWLB SiP with Sn finished passives

ESTC 2014 - 5th Electronics System-Integration Technology Conference

Volumn , Issue , 2014, Pages

  Toole, Eoin O ^a   Almeída, Rodrigo ^a   Campos, José ^a   Martins, Alberto ^a   Cardoso, André ^a   Cardoso, Filipe ^a   Kroehnert, Steffen ^a  

^a NANIUM SA   (Portugal)

Author keywords

[No Author keywords available]

Indexed keywords

BALL GRID ARRAYS; DIFFUSION BARRIERS; GALLIUM ARSENIDE; III-V SEMICONDUCTORS; PHYSICAL VAPOR DEPOSITION; SILICON WAFERS; TIN; TINNING;

DEVELOPMENT PROCESS; HIGH TEMPERATURE STORAGE; INFINEON TECHNOLOGIES; RELIABILITY PERFORMANCE; SCANNING ELECTRONS; SYSTEM-IN-PACKAGE APPLICATIONS; THERMAL PERFORMANCE; WAFER LEVEL PROCESSING;

SYSTEM-IN-PACKAGE;

EID: 84918556654     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ESTC.2014.6962746     Document Type: Conference Paper

References (5)

1. M. Brunnbauer, E. Furgut, G. Beer and T. Meyer, "Embedded Wafer Level Ball Grid Array (eWLB)," in Proc. 8th Electronic PackagingTechnology Conference (EPTC 2006).
2. International Technology Roadmap for Semiconductors http://public.itrs.net.
3. M. Wojnowski, M. Engl, M. Brunnbauer, K. Pressel, G.Sommer, and R. Weigel, "High Frequency Characterization of Thin-Film Redistribution Layers for Embedded Wafer Level BGA," in Proc. 9th Electronic PackagingTechnology Conference (EPTC 2007), Singapore, Dec.2007.
4. M. Wojnowski, V. Issakov, G. Knoblinger, K. Pressel, G.Sommer, and R. Weigel, "High-Q Inductors Embedded in the Fan-Out Area of an eWLB," IEEE Trans. Compon.,Hybrids, Manuf. Technol., vol. 2, no. 8, Aug. 2012
5. Hung-Hsiang Cheng1, Chih-Wen Kuo1, Po-Chih Pan2, Yi-Hua Chen2, Kuo-Hua Chen2, Li Li3, Ken Han3, Glenn Cooper, "Design and Characterization of Power Delivery Systemfor Multi-Chip Package with Embedded Discrete Capacitors", in Proc. Electronic Components and Technology Conference 2011, pp 2079-2184.