Modeling and characterization of micropirani vacuum gauges manufactured by a low-temperature film transfer process

Journal of Microelectromechanical Systems

Volumn 20, Issue 5, 2011, Pages 1184-1191

  Schelcher, Guillaume ^a   Fabbri, Filippo ^a   Lefeuvre, Elie ^a   Brault, Sebastien ^b   Coste, Philippe ^a   Dufour Gergam, Elisabeth ^a   Parrain, Fabien ^a  

^a UNIVERSITÉ PARIS SACLAY   (France)

^b KFM Technology   (France)

Author keywords

3 D heterogeneous integration; Adhesive bonding; low temperature; Pirani vacuum gauge

Indexed keywords

ADHESION CONTROL; ADHESIVE BONDING; AMBIENT GAS PRESSURE; ANALYTICAL MODEL; BENZOCYCLOBUTENE; DONOR WAFERS; EXPERIMENTAL MEASUREMENTS; FILM TRANSFER; FLUOROCARBON FILMS; FUNCTIONAL MICROSTRUCTURE; HETEROGENEOUS INTEGRATION; IN-LINE; LOW TEMPERATURES; LOW-TEMPERATURE ADHESIVES; MICRO BEAMS; MICRO WIRE; MICRO-DEVICE FABRICATION; NI MICROSTRUCTURE; PIRANI GAUGE; PIRANI PRINCIPLE; PIRANI VACUUM GAUGE; STANDARD PERFORMANCE; TRANSFER PROCESS; VACUUM CHAMBERS; VACUUM GAUGES;

ADHESION; BUTENES; GAGES; MATHEMATICAL MODELS; MICROSENSORS; MICROSTRUCTURE; THREE DIMENSIONAL; VACUUM; VACUUM GAGES;

WAFER BONDING;

EID: 80053562999     PISSN: 10577157     EISSN: None     Source Type: Journal    
DOI: 10.1109/JMEMS.2011.2162492     Document Type: Article

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