CMOS-integrable piston-type micro-mirror array for adaptive optics made of mono-crystalline silicon using 3-D integration

Proceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS)

Volumn , Issue , 2009, Pages 1007-1010

  Lapisa, Martin ^a   Zimmer, Fabian ^b   Niklaus, Frank ^a   Gehner, Andreas ^b   Stemme, Göran ^a  

^a ROYAL INSTITUTE OF TECHNOLOGY   (Sweden)

^b FRAUNHOFER INSTITUTE FOR PHOTONIC MICROSYSTEMS   (Germany)

Author keywords

[No Author keywords available]

Indexed keywords

3-D INTEGRATION; ADHESIVE WAFER BONDING; AIR-GAP DISTANCE; CMOS COMPATIBLE; CRYSTALLINE SILICONS; DONOR WAFERS; FABRICATION PROCESS; MICROMIRROR ARRAY; POLYMER SPACERS; SI MIRROR; SILICON-ON-INSULATOR;

CRYSTALLINE MATERIALS; FABRICATION; MIRRORS; WAFER BONDING;

SILICON WAFERS;

EID: 65949110371     PISSN: 10846999     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/MEMSYS.2009.4805556     Document Type: Conference Paper

References (14)

1. P. F. van Kessel, L. J. Hombeck, R. E. Meier, M. R. Douglass, "A MEMS-Based Projection Display", Proc. of the IEEE, Vol. 86, No. 8, pp.1687-1704, 1998
2. R. A. Miller, G. W. Burr, Y. C. Tai, D. Psaltis, "Magnetically actuated MEMS scanning mirror", Proc. of SPIE, Vol. 2687, pp. 47-52, 1996
3. M. F. Dautartas, A. M. Benzoni, Y. C. Chen, G. E. Blonder, B. H. Johnson, C. R. Paola, E. Rice, Y. H. Wong, "A silicon-based moving-mirror optical switch", J. of Lightwave Technology, Vol. 8, pp. 1078-1085, 1992 (Pubitemid 23618158)
4. N. Choksi, D. S. Pickard, M. McCord, R. F. D. Pease, Y. Shroff, Y. Chen, W. Oldham, D. Markle, "Maskless extreme ultraviolet lithography", J. of Vacuum Science and Technology, Vol. 17, pp. 3047-3051, 1999 (Pubitemid 129494283)
5. J. U. Schmidt, M. Friedrichs, T. Bakke, B. Voelker, D. Rudloff, H. Lakner, "Technology development for micromirror arrays with high optical fill factor and stable analogue deflection integrated on CMOS substrates", Proc. ofSPIE, Vol. 6993, pp. 69930D-1 - 6993OD-7, 2008
6. J.U. Schmidt, J. Knobbe, A. Gehner, H. Lakner, "CMOS integrable micro mirrors with highly improved drift-stability", Proc. of SPIE, Vol. 6467, pp. 64670R-1 - 64670R-11, 2007 (Pubitemid 46761906)
7. H. Ehrenreich, H. R. Philipp, B. Segall, "Optical Properties of Aluminum", J. Physical Review, Vol. 132, pp. 1918-1928, 1963
8. I. W. Jung, U. Krishnamoorthy, O. Solgaard, "High fill-factor two-axis gimbaled tip-tilt-piston micromirror array actuated by self-Aligned vertical electrostatic combdrives", J. of Microelectromechanical Systems, Vol. 15, pp. 563-571, 2006 (Pubitemid 43895743)
9. M. A. Michalicek, V. M. Bright, "Flip-chip fabrication of advanced micromirror arrays", Sensors and Actuators, Vol. 95, pp. 152-167, 2002 (Pubitemid 34061303)
10. F. Niklaus, G. Stemme, J.Q. Lu, R.J. Gutmann, "Adhesive wafer bonding", J. of Applied Physics, Vol. 99, pp. 031101-1 - 031101-28, 2006
11. S. van der Groeny, M. Rosmeulen, K. Baert, P. Jansen, L. Deferm, "Substrate bonding techniques for CMOS processed wafers", J. of Micromechanics and Microengineering, Vol. 7, pp. 108-110, 1997 (Pubitemid 127607053)
12. T. Bakke, M. Friedrichs, B. Voelker, M. Reiche, L. Leonardsson, H. Schenk, H. K Lakner, "Spatial light modulators with monocrystalline silicon micromirrors made by wafer bonding", Proc. SPIE, Vol. 5715, pp. 69-79, 2005
13. F. Niklaus, S. Haasl, G. Stemme, "Arrays of monocrystalline silicon micromirrors fabricated using CMOS compatible transfer bonding", J. of Microelectromechanical Systems, Vol. 12, pp. 465-469 2003
14. M. Populin, A. Decharat, F. Niklaus, G. Stemme, "Thermosetting nano-imprint resists: novel materials for adhesive wafer bonding", Proc. of MEMS, pp. 239-242, 2007