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Volumn 2, Issue , 2003, Pages 1638-1642

Optical IMEMS® - A fabrication process for MEMS optical switches with integrated on-chip electronics

Author keywords

Actuators; Consumer electronics; Integrated optics; Micromachining; Micromechanical devices; Mirrors; Optical devices; Optical fiber communication; Optical sensors; Silicon

Indexed keywords

ACTUATORS; COMPOSITE MICROMECHANICS; CONSUMER ELECTRONICS; INTEGRATED OPTICS; MICROMACHINING; MICROSYSTEMS; MIRRORS; MOEMS; OPTICAL COMMUNICATION; OPTICAL DEVICES; OPTICAL FIBER COMMUNICATION; OPTICAL FIBER FABRICATION; OPTICAL FIBERS; OPTICAL SENSORS; SILICON; SOLID-STATE SENSORS; TRANSDUCERS;

EID: 84944728136     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/SENSOR.2003.1217096     Document Type: Conference Paper
Times cited : (28)

References (9)
  • 2
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    • Single-chip 1x84 MEMS Mirror Array for Optical Telecommunication Applications
    • San Jose, CA, Jan.
    • T. Juneau et al., "Single-chip 1x84 MEMS Mirror Array for Optical Telecommunication Applications," SPIE's Photonics West Micromachining and Microfabrication 2003 Symposium, pp. 53-64, San Jose, CA, Jan. 2003.
    • (2003) SPIE's Photonics West Micromachining and Microfabrication 2003 Symposium , pp. 53-64
    • Juneau, T.1
  • 4
    • 0034541675 scopus 로고    scopus 로고
    • Single crystal micromachining using multiple fusion bonded layers
    • Santa Clara, September
    • A. Brown et al., "Single crystal micromachining using multiple fusion bonded layers," Proc SPIE Micromachining and microfabrication process Technology VI, Vol 4174, pp. 406-415, Santa Clara, September 2000.
    • (2000) Proc SPIE Micromachining and Microfabrication Process Technology VI , vol.4174 , pp. 406-415
    • Brown, A.1
  • 5
    • 0042232087 scopus 로고    scopus 로고
    • Fusion-bonded multilayered SOI for MEMS applications
    • Galway, September
    • D. Cole et al., "Fusion-bonded multilayered SOI for MEMS applications," Proc SPIE Nanotechnology and MEMS Int Conf Vol.4876D, Galway, September 2002.
    • (2002) Proc SPIE Nanotechnology and MEMS Int Conf , vol.4876 D
    • Cole, D.1
  • 6
    • 84944761574 scopus 로고    scopus 로고
    • Buried silicon dioxide etching in silicon on insulator (SOI) MEMS applications
    • Galway, September
    • L.A. Doyle et al., "Buried silicon dioxide etching in silicon on insulator (SOI) MEMS applications," Proc SPIE Nanotechnology and MEMS Int Conf Vol.4876D, Galway, September 2002.
    • (2002) Proc SPIE Nanotechnology and MEMS Int Conf , vol.4876 D
    • Doyle, L.A.1
  • 7
    • 0041782990 scopus 로고    scopus 로고
    • State of the Art Deep Silicon Anisotropic Etching on SOI Bonded Substrates for Dielectric Isolation and MEMS Application
    • Oct 17-22
    • C. Gormley et al., "State of the Art Deep Silicon Anisotropic Etching on SOI Bonded Substrates for Dielectric Isolation and MEMS Application", ECS 5th International Wafer Bonding Symposium, pp. 350-361, Oct 17-22 1999.
    • (1999) ECS 5th International Wafer Bonding Symposium , pp. 350-361
    • Gormley, C.1
  • 9
    • 0019675684 scopus 로고
    • A low-noise chopper-stabilized differential switched-capacitor filtering technique
    • Dec.
    • K.-C.Hsieh et al "A low-noise chopper-stabilized differential switched-capacitor filtering technique," IEEE JSSC, vol. SC-16, no. 6, pp. 708-715, Dec. 1981.
    • (1981) IEEE JSSC , vol.SC-16 , Issue.6 , pp. 708-715
    • Hsieh, K.-C.1


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.