Black silicon method X: A review on high speed and selective plasma etching of silicon with profile control: An in-depth comparison between Bosch and cryostat DRIE processes as a roadmap to next generation equipment

Journal of Micromechanics and Microengineering

Volumn 19, Issue 3, 2009, Pages

  Jansen, H V ^a   De Boer, M J ^a   Unnikrishnan, S ^a   Louwerse, M C ^a   Elwenspoek, M C ^a  

^a UNIVERSITY OF TWENTE   (Netherlands)

Author keywords

[No Author keywords available]

Indexed keywords

BLACK SILICON METHODS; CRYOGENIC CONDITIONS; CRYOGENIC ETCHINGS; DEEP REACTIVE ION ETCH; DELAY-TIME; DIFFUSION ZONES; DRIE PROCESS; DUAL POWER; ELECTRO-STATIC CLAMPING; ETCH PROCESS; ETCH PROFILES; ETCH RATES; ETCH SELECTIVITIES; ETCHED STRUCTURES; FEED GAS; FLOW MODELS; GAS PULSE; GAS RESIDENCES; GENERATION EQUIPMENTS; HEAT CONTROLS; HIGH ASPECT RATIO TRENCHES; HIGH ASPECT RATIOS; HIGH ETCH RATES; HIGH-SPEED; INDUCTIVE COUPLED PLASMAS; INHIBITING LAYERS; LOADING EFFECTS; LOW PRESSURES; MASK EROSIONS; MASS FLOW CONTROLLERS; MECHANICAL CLAMPING; METALLIC MASKS; MIXED MODES; MODE OF OPERATIONS; NEW APPROACHES; ORGANIZATION STRUCTURES; OXIDE PRECURSORS; PATTERN LAYOUTS; PHENOMENOLOGICAL MODELS; PLASMA PHYSICS; PROFILE CONTROLS; PULSED MODES; PULSED-MODE OPERATIONS; RESIDENCE TIME; ROAD MAPS; ROOM TEMPERATURES; STEP TIME; SWITCH-ON; TEMPERATURE FLUCTUATIONS; TETRA ETHYL ORTHO SILICATES; THERMAL RESISTANCES; THROTTLE VALVES; TIME-MULTIPLEXED; TURBO PUMPS; VERTICAL WALLS; WAFER TEMPERATURES;

ANISOTROPY; ASPECT RATIO; CONCENTRATION (PROCESS); CRYOGENICS; CRYOSTATS; EROSION; FLUORINE; FREE RADICAL REACTIONS; FREE RADICALS; GASES; HEAT EXCHANGERS; HEAT RESISTANCE; HEATING EQUIPMENT; HELIUM; INDUCTIVELY COUPLED PLASMA; IONIZATION OF LIQUIDS; LIQUID NITROGEN; ORGANIC POLYMERS; OXYGEN; PHOTORESISTS; PLASMA ETCHING; PRESSURE DROP; REVIEWS; SEMICONDUCTING SILICON COMPOUNDS; SILICA; SILICATES; SILICON WAFERS; STRUCTURAL DESIGN; SYNCHRONIZATION; TABLE LOOKUP; TECHNOLOGICAL FORECASTING; TEMPERATURE CONTROL;

PLASMA DIAGNOSTICS;

EID: 61949226199     PISSN: 09601317     EISSN: 13616439     Source Type: Journal    
DOI: 10.1088/0960-1317/19/3/033001     Document Type: Article

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393. Suppliers
394. http://www.alcatelmicromachining.com/ (AMS 100/110/200)
395. http://www.oxfordplasma.de/ (Plasmalab 80/100/133)
396. http://www.stsystems.com/ (ASE standard rate/HRM/Pegasus)
397. http://www.lamrc.com/ (TCP 9400DSiE)
398. http://www.aviza.com/ (DSi, Bosch licence but no further information)
399. http://www.appliedmaterials.com/ (Centura Mariana, not for DRIE)
400. http://www.sentech.com/ (SI 500 c, with cryochuck)
401. http://www.advanced-vacuum.se/ (vision 300, no further info)
402. www.panasonic.com (Panasonic E640 ICP Etcher?)
403. Tokio electronic www.tel.com/eng/
404. Unaxis plasma-therm versalock (does not exist anymore)