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Volumn 19, Issue 2, 2001, Pages 646-650
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Study of a mechanically clamped cryo-chuck device in a high density plasma for deep anisotropic etching of silicon
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Author keywords
[No Author keywords available]
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Indexed keywords
ANISOTROPY;
COMPUTATIONAL METHODS;
CRYOGENICS;
DEFORMATION;
ETCHING;
HEAT TRANSFER;
HELIUM;
MASS TRANSFER;
PRESSURE EFFECTS;
SUBSTRATES;
TEMPERATURE DISTRIBUTION;
DEEP ANISOTROPIC ETCHING;
MECHANICALLY CLAMPED CRYO-CHUCK DEVICES;
SILICON WAFERS;
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EID: 0035272986
PISSN: 07342101
EISSN: None
Source Type: Journal
DOI: 10.1116/1.1339014 Document Type: Article |
Times cited : (2)
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References (8)
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