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Volumn 19, Issue 2, 2001, Pages 646-650

Study of a mechanically clamped cryo-chuck device in a high density plasma for deep anisotropic etching of silicon

Author keywords

[No Author keywords available]

Indexed keywords

ANISOTROPY; COMPUTATIONAL METHODS; CRYOGENICS; DEFORMATION; ETCHING; HEAT TRANSFER; HELIUM; MASS TRANSFER; PRESSURE EFFECTS; SUBSTRATES; TEMPERATURE DISTRIBUTION;

EID: 0035272986     PISSN: 07342101     EISSN: None     Source Type: Journal    
DOI: 10.1116/1.1339014     Document Type: Article
Times cited : (2)

References (8)


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.