Advanced plasma processing combined with trench isolation technology for fabrication and fast prototyping of high aspect ratio MEMS in standard silicon wafers

Journal of Micromechanics and Microengineering

Volumn 14, Issue 9, 2004, Pages

  Sarajlic E ^a   De Boer, M J ^a   Jansen, H V ^a   Arnal, N ^b   Puech, M ^b   Krijnen, G ^a   Elwenspoek, M ^a  

^a UNIVERSITY OF TWENTE   (Netherlands)

^b NOKIA RESEARCH CENTER   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ACTUATORS; MICROMACHINING; MICROPROCESSOR CHIPS; MICROSTRUCTURE; PASSIVATION; SENSORS; SILICON WAFERS; SINGLE CRYSTALS; SOFTWARE PROTOTYPING; TRENCHING;

ON-CHIP ELECTRONICS; PLASMA PROCESSING; PROCESS FLEXIBILITY; VERTICAL TRENCH;

MICROELECTROMECHANICAL DEVICES;

EID: 4544291377     PISSN: 09601317     EISSN: None     Source Type: Journal    
DOI: 10.1088/0960-1317/14/9/012     Document Type: Conference Paper

References (12)

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