Silicon cryo-etching of deep holes

Microelectronic Engineering

Volumn 84, Issue 5-8, 2007, Pages 1120-1123

  Tillocher, T ^a   Dussart, R ^a   Mellhaoui, X ^a   Lefaucheux, P ^a   Boufnichel, M ^b   Ranson, P ^a  

^a UNIVERSITÉ D'ORLÉANS   (France)

^b STMICROELECTRONICS   (France)

Author keywords

Columnar microstructures; Cryo etching; Temperature; Wafer drilling

Indexed keywords

ETCHING; SENSITIVITY ANALYSIS; SILICON WAFERS; SUBSTRATES; TEMPERATURE DISTRIBUTION; THERMAL EFFECTS;

COLUMNAR MICROSTRUCTURES; CRYO-ETCHING; WAFER DRILLING;

CRYOGENICS;

EID: 34247570954     PISSN: 01679317     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.mee.2007.01.148     Document Type: Article

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