Deep plasma silicon etch for microfluidic applications

Surface and Coatings Technology

Volumn 116-119, Issue , 1999, Pages 461-467

  Richter, K ^a   Orfert, M ^a   Howitz, S ^b   Thierbach, S ^a  

^a DRESDEN UNIVERSITY OF TECHNOLOGY   (Germany)

^b GeSiM Co Silicon Microsystems Mbh   (Germany)

Author keywords

Microfluidic devices; Plasma etching; Silicon

Indexed keywords

ANISOTROPY; ASPECT RATIO; FLOW OF FLUIDS; FLUIDICS; PHOTORESISTS; PLASMA ETCHING; PRESSURE EFFECTS;

MICROFLUIDICS;

SILICON;

ETCHING; FLUIDICS; PLASMA TREATMENT; SILICON;

EID: 0033387840     PISSN: 02578972     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0257-8972(99)00112-7     Document Type: Conference Paper

References (5)

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4. Jones H.C., Bennet R., Singh J. Proceedings of 8th Symposium on Plasma Processing. vol. 90-14:1990;59 ECS, Pennington.
5. Bhardwaj J.K., Ashraf H. Proceedings reprint from SPIE, vol. 2639, Micromachining and Microfabrication Process Technology, Austin, Texas. 1995;224.