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Journal of Vacuum Science and Technology A: Vacuum, Surfaces and Films

Volumn 17, Issue 4, 1999, Pages 2280-2285

Pattern shape effects and artefacts in deep silicon etching

(2) Kiihamaki J a Franssila, S b

a VTT TECHNICAL RESEARCH CENTRE OF FINLAND (Finland)

b AALTO UNIVERSITY (Finland)

Author keywords

[No Author keywords available]

Indexed keywords

CIRCULAR HOLES; DEEP ETCHING; DEEP SILICON ETCHING; DIFFERENT SIZES; FEATURE SIZES; HIGH ETCH RATE; PATTERN SHAPE; RATIO DEPENDENCE; TEST STRUCTURE; VERTICAL PROFILE;

ASPECT RATIO; ELECTROMAGNETIC INDUCTION; INDUCTIVELY COUPLED PLASMA;

REACTIVE ION ETCHING;

EID: 33645340155 PISSN: 07342101 EISSN: None Source Type: Journal
DOI: 10.1116/1.581761 Document Type: Conference Paper

Times cited : (85)

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