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Volumn 143, Issue 11, 1996, Pages 3674-3680
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Modeling of heat transport and wafer heating effects during plasma etching
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Author keywords
[No Author keywords available]
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Indexed keywords
ELECTRODES;
ENERGY TRANSFER;
HEAT TRANSFER;
HELIUM;
ION BOMBARDMENT;
MATHEMATICAL MODELS;
PRESSURE EFFECTS;
SILICON WAFERS;
SUBSTRATES;
THERMAL EFFECTS;
THERMAL CONTACT;
WAFER EDGES;
WAFER HEATING;
PLASMA ETCHING;
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EID: 0030284314
PISSN: 00134651
EISSN: None
Source Type: Journal
DOI: 10.1149/1.1837270 Document Type: Article |
Times cited : (19)
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References (15)
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