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Volumn 143, Issue 11, 1996, Pages 3674-3680

Modeling of heat transport and wafer heating effects during plasma etching

Author keywords

[No Author keywords available]

Indexed keywords

ELECTRODES; ENERGY TRANSFER; HEAT TRANSFER; HELIUM; ION BOMBARDMENT; MATHEMATICAL MODELS; PRESSURE EFFECTS; SILICON WAFERS; SUBSTRATES; THERMAL EFFECTS;

EID: 0030284314     PISSN: 00134651     EISSN: None     Source Type: Journal    
DOI: 10.1149/1.1837270     Document Type: Article
Times cited : (19)

References (15)
  • 11
    • 5844266867 scopus 로고
    • Perkin-Elmer Corporation, Norwalk, CT (unpublished data)
    • D. H. Tracy and S. A. Myers, Perkin-Elmer Corporation, Norwalk, CT (unpublished data), 1983; see also p. 262 in Ref. 8.
    • (1983)
    • Tracy, D.H.1    Myers, S.A.2
  • 12
    • 5844318913 scopus 로고    scopus 로고
    • D. H. Tracy and S. A. Myers, Perkin-Elmer Corporation, Norwalk, CT (unpublished data), 1983; see also p. 262 in Ref. 8.
    • Plasma Processing for VLSI , pp. 262
  • 13


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.