Etching methodologies in 〈111〉-oriented silicon wafers

Journal of Microelectromechanical Systems

Volumn 9, Issue 3, 2000, Pages 390-398

  Oosterbroek, R Edwin ^a   Berenschot, J W ^a   Jansen, Henri V ^b   Nijdam, A Jasper ^a   Pandraud, Grégory ^c   Van Den Berg, Albert ^a   Elwenspoek, Miko C ^a  

^a UNIVERSITY OF TWENTE   (Netherlands)

^b IMEC   (Belgium)

^c Bookham Technology   (United Kingdom)

Author keywords

[No Author keywords available]

Indexed keywords

ANISOTROPY; BEAMS AND GIRDERS; CRYSTAL ORIENTATION; MASKS; MICROMACHINING; PASSIVATION; REACTIVE ION ETCHING; SILICON WAFERS;

SMART MASK-TO-CRYSTAL-ORIENTATION ALIGNMENTS; WET CHEMICAL ETCHING;

MICROELECTROMECHANICAL DEVICES;

EID: 0034270086     PISSN: 10577157     EISSN: None     Source Type: Journal    
DOI: 10.1109/84.870065     Document Type: Article

References (26)

1. G. T. A. Kovacs, N. I. Maluf, and K. E. Petersen, "Bulk micromachining of silicon," Proc. IEEE, vol. 86, pp. 1536-1551, Aug. 1998.
2. K. E. Petersen, "Silicon as a mechanical material," Proc IEEE, vol. 70, pp. 420-457, May 1982.
3. R. W. Tjerkstra, M. de Boer, E. Berenschot, J. G. E. Gardeniers, A. van den Berg, and M. Elwenspoek, "Etching technology for microchannels," in Proc. IEEE MEMS '97, pp. 147-152.
4. A. van den Berg and R. B. M. Schasfoort, "Capillary ion electrophoresis in μ transparent insulating channel devices using micro conductivity detection," in Proc. IEEE Transducers '99, pp. 872-875.
5. H. Seidel, L. Csepregi, A. Heuberger, and H. Baumgärtel, "Anisotropic etching of crystalline silicon in alkaline solutions; I orientation dependence and behavior of passivation layers," J. Electrochemical Soc., vol. 137, no. 11, pp. 3612-3622, 1990.
6. P. Allongue, V. Costa-Kieling, and H. Gerisher, "Etching of silicon in NaOH solutions I: In situ STM investigation of n-Si(111)," J. Electrochem. Soc., vol. 140, pp. 1009-1018, 4 1993.
7. M. Elwenspoek, "The form of etch rate minima in wet chemical anisotropic etching of silicon," J. Micromech. Microeng., vol. 6, pp. 405-409, 1996.
8. J. Kasparian, M. Elwenspoek, and P. Allongue, "Digital computation and in situ STM imaging of silicon anisotropic etching," Surf. Sci., vol. 388, pp. 50-62, 1997.
9. N. Dumbrãvescu and M. Ilie, "Replication of diffractive gratings using embossing into UV-cured photopolymers," in Proc. SPIE Micromach. Tech. Diffractive Holograph. Opt. Conf., vol. 3879, 1999, pp. 206-213.
10. A. J. Nijdam, J. W. Berenschot, J. van Suchtelen, J. G. E. Gardeniers, and M. Elwenspoek, "Velocity sources as an explanation for experimentally observed variations in Si{111} etch rates," J. Micromech. Microeng., vol. 9, pp. 135-138, 1999.
11. A. Ludwig, W. Pfeging, and E. Quandt, "Fabrication of a magnetostrictive membrane-type micropump by means of magnetron sputtering and laser assisted silicon micromachining," in Proc. 6th Int. New Actuators Conf., Bremen, Germany, 1998, pp. 376-379.
12. M. Alavi, S. Büttgenbach, A. Schumacher, and H. J. Wagner, "Laser machining of silicon for fabrication of new microstructures," in Proc. IEEE Transducers '91, pp. 512-515.
13. M. Alavi, A. Schumacher, and H. J. Wagner, "Laser machining and anisotropic etching of (111) silicon for applications in microsystems," in Proc. Micro Syst. Technol., 1991, pp. 227-231.
14. H. V. Jansen, M. J. de Boer, R. Legtenberg, and M. C. Elwenspoek, "The black silicon method: A universal method for determining the parameter setting of a fluorine-based reactive ion etcher in deep silicon trench etching with profile control," J. Micromech. Microeng., vol. 5, pp. 115-120, 1995.
15. H. Wensink, M. J. de Boer, R. J. Wiegerink, R. A. F. Zwijze, and M. C. Elwenspoek, "First micromachined silicon load cell for loads up to 1000 kg," Proc. SPIE. Micromach. Devices Comp. IV, vol. 3514, pp. 424-430, 1998.
16. J. W. Berenschot, R. E. Oosterbroek, T. S. J. Lammerink, and M. C. Elwenspoek, "Micromachining of {111} plates in (001) oriented silicon," J. Micromech. Microeng., vol. 8, pp. 104-107, 1998.
17. R. E. Oosterbroek, J. W. Berenschot, S. Schlautmann, T. S. J. Lammerink, A. van den Berg, and M. C. Elwenspoek, "In-plane oriented fluid control components, fabricated with new etching techniques," in Actuators '98, pp. 43-46.
18. R. E. Oosterbroek, J. W. Berenschot, S. Schlautmann, T. S. J. Lammerink, G. J. M. Krijnen, M. C. Elwenspoek, and A. van den Berg, "Characterization and optimization of mono-crystalline in-plane operating check valves," in Proc. IEEE Transducers '99, pp. 1816-1819.
19. G. Ensell, "Free standing single-crystal silicon microstructures," J. Micromech. Microeng., vol. 5, pp. 1-4, 1995.
20. B. C. S. Chou, C. N. Chen, and J. S. Shie, "Micromachining on (111)-oriented silicon," Sens. Actuators, vol. 75, pp. 271-277, 1999.
21. S. Lee, S. Park, and D. Cho, "A new micromachining technique with (111) silicon," Jpn. J. Appl. Phys., vol. 1-5A, pp. 2699-2703, 1999.
22. S. Park, S. Lee, S. Yi, and D. Cho, "Mesa-supported, single-crystal microstructures fabricated by the surface/bulk micromachining process," Jpn. J. Appl. Phys., vol. 1-7A, pp. 4244-4249, 1999.
23. J. G. Fleming, "Combining the best of bulk and surface micromachining using Si {111} substrates," in Proc. SPIE Micromach. Microfab. IV Tech. Conf., vol. 3511, 1998, pp. 162-168.
24. J. D. Patterson, "Micro-mechanical voltage tunable Fabry-Perot filters formed in (111) silicon," Langley Res. Center, Hampton, VA. NASA Tech. paper 3702, 1997.
25. G. Pandraud, G. Veldhuis, J. W. Berenschot, A. J. Nijdam, H. J. W. M. Hoekstra, O. Parriaux, and P. V. Lambeck, "Micromachining of high contrast optical waveguides," IEEE Photon. Technol. Lett., vol. 12, pp. 308-310, Mar. 2000.
26. K. A. Shaw, Z. L. Zhang, and N. C. MacDonald, "SCREAM I: A single mask, single-crystal silicon, reactive ion etching process for microelectromechanical structures," Sens. Actuators A, Phys., vol. A40, pp. 63-70, 1994.