Loading effects in deep silicon etching

Proceedings of SPIE - The International Society for Optical Engineering

Volumn 4174, Issue 1, 2000, Pages 90-97

  Karttunen, Jani ^a   Kiihamaki, Jyrki ^a   Franssila, Sami ^b  

^a VTT Electronics   (United States)

^b AALTO UNIVERSITY   (Finland)

Author keywords

Etch rate; MEMS; Pattern density; Plasma etching; Uniformity

Indexed keywords

ASPECT RATIO; MICROELECTROMECHANICAL DEVICES; MICROPROCESSOR CHIPS; PLASMA ETCHING; SILICON WAFERS;

CHIP PATTERN DENSITY; DEEP SILICON ETCHING;

MICROMACHINING;

EID: 0034543790     PISSN: 0277786X     EISSN: None     Source Type: Journal    
DOI: 10.1117/12.396475     Document Type: Article

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