Cryogenic etching of deep narrow trenches in silicon

Journal of Vacuum Science and Technology A: Vacuum, Surfaces and Films

Volumn 18, Issue 4, 2000, Pages 1848-1852

  Aachboun, S ^a   Ranson, P ^a   Hilbert, C ^a   Boufnichel, M ^a  

^a UNIVERSITÉ D'ORLÉANS   (France)

Author keywords

[No Author keywords available]

Indexed keywords

ANISOTROPY; ASPECT RATIO; CRYOGENICS; DEFORMATION; MASKS; PLASMA ETCHING; SILICA; THERMAL EFFECTS;

CRYOGENIC ETCHING;

SILICON WAFERS;

EID: 0034229077     PISSN: 07342101     EISSN: None     Source Type: Journal    
DOI: 10.1116/1.582434     Document Type: Article

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