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Volumn 70, Issue 1-2, 1998, Pages 61-66

Fabrication of multi-layer substrates for high aspect ratio single crystalline microstructures

Author keywords

Chemical mechanical polishing; Direct wafer bonding; Microelectromechanical systems (MEMS); Multilayer substrates; Reactive ion etching; Silicon on insulator

Indexed keywords


EID: 0041636126     PISSN: 09244247     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0924-4247(98)00113-7     Document Type: Article
Times cited : (12)

References (18)
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  • 3
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  • 4
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  • 7
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    • Bulk silicon micro electromechanical devices fabricated from commercial BESOI substrates
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  • 9
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  • 11
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    • to be published in Athens, Greece
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    • (1997) Proceedings of Micro Nano Engineering
    • Jansen, H.1    De Boer, M.2    Wensink, H.3    Kloeck, B.4    Elwenspoek, M.5
  • 13
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    • Polysilicon to silicon bonding in laminated dielectrically isolated (LDI) wafers
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  • 14
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    • Characteristics of new dielectric isolation wafers for high power IC's by single-Si poly-Si direct bonding (SPSDB) technique
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  • 16
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    • Blackstone, S.1


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.