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Volumn , Issue , 2012, Pages 1-33

Low-k Materials: Recent Advances

Author keywords

Dielectric; Dual damascene; Hybrid organic inorganic; Integration challenges; Low k; Mechanical properties; Oxycarbosilanes; Porous materials; Post deposition treatment; Process damage; Silica zeolites

Indexed keywords


EID: 84872708504     PISSN: None     EISSN: None     Source Type: Book    
DOI: 10.1002/9781119963677.ch1     Document Type: Chapter
Times cited : (13)

References (180)
  • 1
    • 75649126879 scopus 로고    scopus 로고
    • Low dielectric constant materials
    • Volksen, W., Miller, R.D. and Dubois, G. (2010) Low dielectric constant materials. Chem. Rev., 110, 56-110.
    • (2010) Chem. Rev. , vol.110 , pp. 56-110
    • Volksen, W.1    Miller, R.D.2    Dubois, G.3
  • 3
    • 0035247798 scopus 로고    scopus 로고
    • Low dielectric constant polymers for microelectronics
    • Maier, G. (2001) Low dielectric constant polymers for microelectronics. Prog. Polym. Sci., 26, 3-65.
    • (2001) Prog. Polym. Sci. , vol.26 , pp. 3-65
    • Maier, G.1
  • 4
    • 0035751056 scopus 로고    scopus 로고
    • Polyimides in microelectronics applications
    • Miwa, T. (2001) Polyimides in microelectronics applications. J. Photopolym. Sci. Technol., 14, 29-32.
    • (2001) J. Photopolym. Sci. Technol. , vol.14 , pp. 29-32
    • Miwa, T.1
  • 6
    • 0001827706 scopus 로고    scopus 로고
    • Low dielectric constant materials for interlayer dielectrics, in Handbook of Low and High Dielectric Constant Materials and Their Applications (ed
    • Academic Press, San Diego, California
    • Treichel, H., Withers, B., Ruhl, G., Ansmann, P., Wurl, R., Muller, C., Dietlmeier, M. and Maier, G. (1999) Low dielectric constant materials for interlayer dielectrics, in Handbook of Low and High Dielectric Constant Materials and Their Applications (ed. Nalwa, H.S.), vol. 1, Academic Press, San Diego, California, pp. 1-71.
    • (1999) Nalwa, H.S.), vol. , vol.1 , pp. 1-71
    • Treichel, H.1    Withers, B.2    Ruhl, G.3    Ansmann, P.4    Wurl, R.5    Muller, C.6    Dietlmeier, M.7    Maier, G.8
  • 7
    • 84950317098 scopus 로고    scopus 로고
    • Spin-on dielectric materials
    • (eds Baklanov, M., Maex, K. and Green, M.), John Wiley&Sons, Inc., New York.
    • Dubois, G., Volksen, W. and Miller, R.D. (2007) Spin-on dielectric materials, in Dielectric Films for Advanced Microelectronics (eds Baklanov, M., Maex, K. and Green, M.), John Wiley&Sons, Inc., New York.
    • (2007) Dielectric Films for Advanced Microelectronics
    • Dubois, G.1    Volksen, W.2    Miller, R.D.3
  • 9
    • 0032162553 scopus 로고    scopus 로고
    • Low dielectric constant materials and methods for interlayer dielectric films in ultralarge-scale integrated circuit multilevel interconnections
    • Homma, T. (1998) Low dielectric constant materials and methods for interlayer dielectric films in ultralarge-scale integrated circuit multilevel interconnections. Mater. Sci. Engng, R, R23, 243-285.
    • (1998) Mater. Sci. Engng, R, , vol.R23 , pp. 243-285
    • Homma, T.1
  • 10
    • 0002464137 scopus 로고
    • Kirk-Othmer Encyclopedia of Chemical Technology
    • 3rd edn, John Wiley&Sons, Inc., New York
    • Kirk-Othmer (1992) Kirk-Othmer Encyclopedia of Chemical Technology, 3rd edn, vol. 20, John Wiley&Sons, Inc., New York, pp. 748-825.
    • (1992) , vol.20 , pp. 748-825
    • Kirk-Othmer1
  • 11
    • 84887226882 scopus 로고    scopus 로고
    • Low and ultralow dielectric constant films prepared by plasma-enhanced chemical vapor deposition
    • (eds Baklanov, M., Maex, K. and Green, M.), John Wiley&Sons, Inc., New York.
    • Grill, A. (2007) Low and ultralow dielectric constant films prepared by plasma-enhanced chemical vapor deposition, in Dielectric Films for Advanced Microelectronics (eds Baklanov, M., Maex, K. and Green, M.), John Wiley&Sons, Inc., New York.
    • (2007) Dielectric Films for Advanced Microelectronics
    • Grill, A.1
  • 12
    • 67650935869 scopus 로고    scopus 로고
    • Porous pSICOH ultralow-k dielectrics for chip interconnects prepared by PECVD
    • Grill, A. (2009) Porous pSICOH ultralow-k dielectrics for chip interconnects prepared by PECVD. Annu. Rev. Mater. Sci., 39, 49-69.
    • (2009) Annu. Rev. Mater. Sci. , vol.39 , pp. 49-69
    • Grill, A.1
  • 16
    • 84885776291 scopus 로고    scopus 로고
    • Porosity of low dielectric materials. Ellipsometric porosimetry
    • (eds Baklanov, M., Maex, K. and Green, M.), John Wiley&Sons, Inc., New York
    • Baklanov, M.R. (2007) Porosity of low dielectric materials. Ellipsometric porosimetry, in Dielectric Films for Advanced Microelectronics (eds Baklanov, M., Maex, K. and Green, M.), John Wiley&Sons, Inc., New York.
    • (2007) Dielectric Films for Advanced Microelectronics
    • Baklanov, M.R.1
  • 17
    • 84885776291 scopus 로고    scopus 로고
    • Porosity of low dielectric materials. Positron annihilation spectroscopy
    • (eds Baklanov, M., Maex, K. and Green, M.), John Wiley&Sons, Inc., New York
    • Gidley, D.W., Peng, H.-g. and Vallery, R. (2007) Porosity of low dielectric materials. Positron annihilation spectroscopy, in Dielectric Films for Advanced Microelectronics (eds Baklanov, M., Maex, K. and Green, M.), John Wiley&Sons, Inc., New York.
    • (2007) Dielectric Films for Advanced Microelectronics
    • Gidley, D.W.1    Peng, H.-g.2    Vallery, R.3
  • 19
    • 84885701116 scopus 로고    scopus 로고
    • Porosity of low dielectric materials. Structure characterization of nanoporous interlevel dielectric thin films with X-ray and neutron radiation
    • (eds Baklanov, M., Maex, K. and Green, M.), John Wiley&Sons, Inc., New York
    • Soles, C.L., Lee, H.-J., Vogt, B.D., Lin, E.K. and Wu, W.-L. (2007) Porosity of low dielectric materials. Structure characterization of nanoporous interlevel dielectric thin films with X-ray and neutron radiation, in Dielectric Films for Advanced Microelectronics (eds Baklanov, M., Maex, K. and Green, M.), John Wiley&Sons, Inc., New York.
    • (2007) Dielectric Films for Advanced Microelectronics
    • Soles, C.L.1    Lee, H.-J.2    Vogt, B.D.3    Lin, E.K.4    Wu, W.-L.5
  • 20
    • 84885186321 scopus 로고    scopus 로고
    • Silicon Processing for the VLSI Era, Deep-Submicron Process Technology
    • Lattice Press, Sunset Beach, California.
    • Wolf, S. (2002) Silicon Processing for the VLSI Era, vol. 4, Deep-Submicron Process Technology, Lattice Press, Sunset Beach, California.
    • (2002) , vol.4
    • Wolf, S.1
  • 21
    • 4944235009 scopus 로고    scopus 로고
    • Physical and barrier properties of amorphous silicon-oxycarbide deposited by PECVD from octamethylcyclotetrasiloxane
    • Chiang, C.-C. Chen, M.-C., Li, L.-J., Wu, Z.-C., Jang, S.-M. and Liang, M.-S. (2004) Physical and barrier properties of amorphous silicon-oxycarbide deposited by PECVD from octamethylcyclotetrasiloxane. J. Electrochem. Soc., 151, G612-G617.
    • (2004) J. Electrochem. Soc. , vol.151
    • Chiang, C.-C.1    Chen, M.-C.2    Li, L.-J.3    Wu, Z.-C.4    Jang, S.-M.5    Liang, M.-S.6
  • 22
    • 84944056599 scopus 로고    scopus 로고
    • Leakage and breakdown mechanisms in Cu damascene with a bilayer-structured a-SiCN/a-SiC dielectric barrier
    • Burlingame, California
    • Chiang, C.-C., Ko, I.H. and Chen, M.-C. (2003) Leakage and breakdown mechanisms in Cu damascene with a bilayer-structured a-SiCN/a-SiC dielectric barrier. Proceedings of the 6th IEEE International Interconnect Technology Conference, Burlingame, California, pp. 201-203.
    • (2003) Proceedings of the 6th IEEE International Interconnect Technology Conference , pp. 201-203
    • Chiang, C.-C.1    Ko, I.H.2    Chen, M.-C.3
  • 23
    • 4944265056 scopus 로고    scopus 로고
    • Improvement in leakage current and breakdown field of Cu-comb capacitor using a silicon oxycarbide dielectric barrier
    • Chiang, C.-C., Ko, I.H., Chen, M.-C., Wu, Z.-C., Lu, Y.-C., Jang, S.-M. and Liang, M.-S. (2004) Improvement in leakage current and breakdown field of Cu-comb capacitor using a silicon oxycarbide dielectric barrier. J. Electrochem. Soc., 151, G606-G611.
    • (2004) J. Electrochem. Soc. , vol.151
    • Chiang, C.-C.1    Ko, I.H.2    Chen, M.-C.3    Wu, Z.-C.4    Lu, Y.-C.5    Jang, S.-M.6    Liang, M.-S.7
  • 26
    • 33744501237 scopus 로고    scopus 로고
    • Fracture of nanoporous methyl silsesquioxane thin-film glasses
    • Guyer, E.P., Patz, M. and Dauskardt, R.H. (2006) Fracture of nanoporous methyl silsesquioxane thin-film glasses. J. Mater. Res., 21, 882-894.
    • (2006) J. Mater. Res. , vol.21 , pp. 882-894
    • Guyer, E.P.1    Patz, M.2    Dauskardt, R.H.3
  • 28
    • 40849118377 scopus 로고    scopus 로고
    • Interface engineering for high interfacial strength between SiCOH and porous SiCOH interconnect dielectrics and diffusion caps
    • Grill, A., Edelstein, D., Lane, M., Patel, V., Gates, S., Restaino, D. and Molis, S. (2008) Interface engineering for high interfacial strength between SiCOH and porous SiCOH interconnect dielectrics and diffusion caps. J. Appl. Phys., 103, 054104/054101-054104/054106.
    • (2008) J. Appl. Phys. , vol.103
    • Grill, A.1    Edelstein, D.2    Lane, M.3    Patel, V.4    Gates, S.5    Restaino, D.6    Molis, S.7
  • 33
    • 20344401784 scopus 로고    scopus 로고
    • Process improvement of 0.13 mm Cu/low k (Black Diamond) dual damascene interconnection
    • Li, H.Y., Su, Y.J., Tsang, C.F., Sohan, S.M., Bliznetsov, V. and Zhang, L. (2004) Process improvement of 0.13 mm Cu/low k (Black Diamond) dual damascene interconnection. Microelectron. Reliab., 45, 1134-1143.
    • (2004) Microelectron. Reliab. , vol.45 , pp. 1134-1143
    • Li, H.Y.1    Su, Y.J.2    Tsang, C.F.3    Sohan, S.M.4    Bliznetsov, V.5    Zhang, L.6
  • 36
    • 84885724642 scopus 로고    scopus 로고
    • Methods/principles of deposition and etching of thin-films
    • 2nd edn (eds Schwartz, G.C. and Srikrishnan, K.V.), CRC Press, Boca Raton, Florida.
    • Schwartz, G.C. (2006) Methods/principles of deposition and etching of thin-films, in Handbook of Semiconductor Interconnection Technology, 2nd edn (eds Schwartz, G.C. and Srikrishnan, K.V.), CRC Press, Boca Raton, Florida.
    • (2006) Handbook of Semiconductor Interconnection Technology
    • Schwartz, G.C.1
  • 38
    • 0142011574 scopus 로고    scopus 로고
    • Material modification of the patterned wafer during dry etching and strip determined by XPS
    • Furukawa, Y., Patz, M., Kokubo, T. and Snijders, J.H.M. (2003) Material modification of the patterned wafer during dry etching and strip determined by XPS. Microelectron. Engng, 70, 267-273.
    • (2003) Microelectron. Engng , vol.70 , pp. 267-273
    • Furukawa, Y.1    Patz, M.2    Kokubo, T.3    Snijders, J.H.M.4
  • 39
  • 40
    • 3843112189 scopus 로고    scopus 로고
    • Via fill properties of organic BARCs in dual-damascene application
    • Santa Clara, California
    • Huang, R. (2004) Via fill properties of organic BARCs in dual-damascene application. Proceedings of SPIE-International Society of Optical Engineering, Santa Clara, California, pp. 711-717.
    • (2004) Proceedings of SPIE-International Society of Optical Engineering , pp. 711-717
    • Huang, R.1
  • 45
    • 0035450040 scopus 로고    scopus 로고
    • Cleaning status on low-k dielectric in advanced VLSI interconnect: characterisation and principal issues
    • Louis, D., Beverina, A., Arvet, C., Lajoinie, E., Peyne, C., Holmes, D. and Maloney, D. (2001) Cleaning status on low-k dielectric in advanced VLSI interconnect: characterisation and principal issues. Microelectron. Engng, 57-58, 621-627.
    • (2001) Microelectron. Engng , vol.57-58 , pp. 621-627
    • Louis, D.1    Beverina, A.2    Arvet, C.3    Lajoinie, E.4    Peyne, C.5    Holmes, D.6    Maloney, D.7
  • 48
    • 0036677392 scopus 로고    scopus 로고
    • Factors affecting an efficient sealing of porous low-k dielectrics by physical vapor deposition Ta(N) thin films
    • Iacopi, F., Tokei, Z., Le, Q.T., Shamiryan, D., Conard, T., Brijs, B., Kreissig, U., Van Hove, M. and Maex, K. (2002) Factors affecting an efficient sealing of porous low-k dielectrics by physical vapor deposition Ta(N) thin films. J. Appl. Phys., 92, 1548-1554.
    • (2002) J. Appl. Phys. , vol.92 , pp. 1548-1554
    • Iacopi, F.1    Tokei, Z.2    Le, Q.T.3    Shamiryan, D.4    Conard, T.5    Brijs, B.6    Kreissig, U.7    Van Hove, M.8    Maex, K.9
  • 54
    • 84883338930 scopus 로고    scopus 로고
    • IBM's Packaging Technology Roadmap and the 'collaboratory' approach to advanced packaging development
    • Kyoto, Japan
    • Brofman, P. (2009) IBM's Packaging Technology Roadmap and the 'collaboratory' approach to advanced packaging development. Proceedings of the International Conference on Electronics Packaging, ICEP 2009, Kyoto, Japan, pp. 1-6.
    • (2009) Proceedings of the International Conference on Electronics Packaging, ICEP , vol.2009 , pp. 1-6
    • Brofman, P.1
  • 56
    • 72449176317 scopus 로고    scopus 로고
    • Fracture phenomena induced by frontend/ back-end interactions: dedicated failure analysis and numerical developments
    • Gallois-Garreignot, S., Fiori, V. and Nelias, D. (2010) Fracture phenomena induced by frontend/ back-end interactions: dedicated failure analysis and numerical developments. Microelectron. Reliab., 50, 75-85.
    • (2010) Microelectron. Reliab. , vol.50 , pp. 75-85
    • Gallois-Garreignot, S.1    Fiori, V.2    Nelias, D.3
  • 57
    • 35348873558 scopus 로고    scopus 로고
    • Facing the challenge of designing for Cu/low-k reliability
    • Van Driel, W.D. (2007) Facing the challenge of designing for Cu/low-k reliability. Microelectron. Engng, 47, 1969-1974.
    • (2007) Microelectron. Engng , vol.47 , pp. 1969-1974
    • Van Driel, W.D.1
  • 59
    • 20344395335 scopus 로고    scopus 로고
    • Chip-packaging interaction: a critical concern for Cu/low k packaging
    • Wang, G., Ho, P.S. and Groothuis, S. (2005) Chip-packaging interaction: a critical concern for Cu/low k packaging. Microelectron. Reliab., 45, 1079-1093.
    • (2005) Microelectron. Reliab. , vol.45 , pp. 1079-1093
    • Wang, G.1    Ho, P.S.2    Groothuis, S.3
  • 64
    • 77952652975 scopus 로고    scopus 로고
    • Effects of e-beam curing on glass structure and mechanical properties of nanoporous organosilicate thin films
    • Gage, D.M., Peng, L., Stebbins, J., Yim, K.S., Al-Bayati, A., Demos, A. and Dauskardt, R.H. (2010) Effects of e-beam curing on glass structure and mechanical properties of nanoporous organosilicate thin films. Int. J. Mater. Res., 101, 228-235.
    • (2010) Int. J. Mater. Res. , vol.101 , pp. 228-235
    • Gage, D.M.1    Peng, L.2    Stebbins, J.3    Yim, K.S.4    Al-Bayati, A.5    Demos, A.6    Dauskardt, R.H.7
  • 66
    • 33644934714 scopus 로고    scopus 로고
    • Improvement of mechanical properties of porous SiOCH films by post-cure treatments
    • Colorado Springs, Colorado and Tokyo, Japan
    • Ito, F., Takeuchi, T. and Hayashi, Y. (2006) Improvement of mechanical properties of porous SiOCH films by post-cure treatments. Proceedings of the Advances in Metals Conference 2005, Colorado Springs, Colorado and Tokyo, Japan, pp. 291-296.
    • (2006) Proceedings of the Advances in Metals Conference , vol.2005 , pp. 291-296
    • Ito, F.1    Takeuchi, T.2    Hayashi, Y.3
  • 71
    • 33751212199 scopus 로고    scopus 로고
    • UV curing effects on mechanical and electrical performances of a PECVD non-porogen porous SiOC:H films (in k [2.2-2.4] range) for 45 nm node and below
    • Chapelon, L.L., Vitiello, J., Gonchond, J.P., Barbier, D. and Torres, J. (2006) UV curing effects on mechanical and electrical performances of a PECVD non-porogen porous SiOC:H films (in k [2.2-2.4] range) for 45 nm node and below. Microelectron. Engng, 83, 2136-2141.
    • (2006) Microelectron. Engng , vol.83 , pp. 2136-2141
    • Chapelon, L.L.1    Vitiello, J.2    Gonchond, J.P.3    Barbier, D.4    Torres, J.5
  • 73
    • 70350158566 scopus 로고    scopus 로고
    • Effects of ultraviolet radiation on ultra-low-dielectric constant thin film fracture properties
    • Smith, R.S., Tsui, T.Y. and Ho, P.S. (2009) Effects of ultraviolet radiation on ultra-low-dielectric constant thin film fracture properties. J. Mater. Res., 24, 2795-2801.
    • (2009) J. Mater. Res. , vol.24 , pp. 2795-2801
    • Smith, R.S.1    Tsui, T.Y.2    Ho, P.S.3
  • 74
    • 41549107740 scopus 로고    scopus 로고
    • The effect of ultraviolet light curing on the material and fracture properties of a k~2.5 low-k dielectric
    • Smith, R.S., Tsui, T. and Ho, P.S. (2007) The effect of ultraviolet light curing on the material and fracture properties of a k~2.5 low-k dielectric. Proceedings of the Materials Research Society Symposium, pp. 27-31.
    • (2007) Proceedings of the Materials Research Society Symposium , pp. 27-31
    • Smith, R.S.1    Tsui, T.2    Ho, P.S.3
  • 75
    • 77953012729 scopus 로고    scopus 로고
    • Porogen residues detection in optical properties of low-k dielectrics cured by ultraviolet radiation
    • Marsik, P., Verdonck, P., De Roest, D. and Baklanov, M.R. (2010) Porogen residues detection in optical properties of low-k dielectrics cured by ultraviolet radiation. Thin Solid Films, 518, 4266-4272.
    • (2010) Thin Solid Films , vol.518 , pp. 4266-4272
    • Marsik, P.1    Verdonck, P.2    De Roest, D.3    Baklanov, M.R.4
  • 77
    • 33846070611 scopus 로고    scopus 로고
    • Influence of electron-beam and ultraviolet treatments on low-k porous dielectrics
    • Martinez, E., Rochat, N., Guedj, C., Licitra, C., Imbert, G. and Le Friec, Y. (2006) Influence of electron-beam and ultraviolet treatments on low-k porous dielectrics. J. Appl. Phys., 100, 124106/124101-124106/124105.
    • (2006) J. Appl. Phys. , vol.100
    • Martinez, E.1    Rochat, N.2    Guedj, C.3    Licitra, C.4    Imbert, G.5    Le Friec, Y.6
  • 83
    • 69249191580 scopus 로고    scopus 로고
    • Tailoring UV cure depth profiles for optimal mechanical properties of organosilicate thin films
    • Kim, T.-S., Chumakov, D., Zschech, E. and Dauskardt, R.H. (2009) Tailoring UV cure depth profiles for optimal mechanical properties of organosilicate thin films. Appl. Phys. Lett., 95, 071902/071901-071902/071903.
    • (2009) Appl. Phys. Lett. , vol.95
    • Kim, T.-S.1    Chumakov, D.2    Zschech, E.3    Dauskardt, R.H.4
  • 84
    • 51449115467 scopus 로고    scopus 로고
    • PECVD low-permittivity organosilicate glass coatings: adhesion, fracture and mechanical properties
    • Lin, Y., Xiang, Y., Tsui, T.Y. and Vlassak, J.J. (2008) PECVD low-permittivity organosilicate glass coatings: adhesion, fracture and mechanical properties. Acta Mater., 56, 4932-4943.
    • (2008) Acta Mater. , vol.56 , pp. 4932-4943
    • Lin, Y.1    Xiang, Y.2    Tsui, T.Y.3    Vlassak, J.J.4
  • 85
    • 3142552846 scopus 로고    scopus 로고
    • A new approach to ultralow-k dielectrics
    • 60
    • Calvert, J.M. and Gallagher, M.K. (2003) A new approach to ultralow-k dielectrics. Semicond. Int., 26, 56-58, 60.
    • (2003) Semicond. Int. , vol.26 , pp. 56-58
    • Calvert, J.M.1    Gallagher, M.K.2
  • 86
  • 88
    • 84950321295 scopus 로고    scopus 로고
    • Electronic device manufacture
    • Patent 6,667,147 B2.
    • Gallagher, M.K. and You, Y. (2002) Electronic device manufacture, Patent 6,667,147 B2.
    • (2002)
    • Gallagher, M.K.1    You, Y.2
  • 89
    • 33646497935 scopus 로고    scopus 로고
    • Plasma-enhancedchemical- vapor-deposited ultralow k for a postintegration porogen removal approach
    • Jousseaume, V., Favennec, L., Zenasni, A. and Passemard, G. (2006) Plasma-enhancedchemical- vapor-deposited ultralow k for a postintegration porogen removal approach. Appl. Phys. Lett., 88, 182908/182901-182908/182903.
    • (2006) Appl. Phys. Lett. , vol.88
    • Jousseaume, V.1    Favennec, L.2    Zenasni, A.3    Passemard, G.4
  • 91
    • 0031256186 scopus 로고    scopus 로고
    • Nanoporous silica as an ultralowk dielectric
    • Jin, C., Luttmer, J.D., Smith, D.M. and Ramos, T.A. (1997) Nanoporous silica as an ultralowk dielectric. MRS Bull., 22, 39-42.
    • (1997) MRS Bull. , vol.22 , pp. 39-42
    • Jin, C.1    Luttmer, J.D.2    Smith, D.M.3    Ramos, T.A.4
  • 92
    • 4544343185 scopus 로고    scopus 로고
    • Ultra thin CVD TiN layers as diffusion barrier films on porous low-k materials
    • Bonitz, J., Schulz, S.E. and Gessner, T. (2004) Ultra thin CVD TiN layers as diffusion barrier films on porous low-k materials. Microelectron. Engng, 76, 82-88.
    • (2004) Microelectron. Engng , vol.76 , pp. 82-88
    • Bonitz, J.1    Schulz, S.E.2    Gessner, T.3
  • 96
    • 4544274746 scopus 로고    scopus 로고
    • Damage minimized plasma pore sealing of microporous low-k dielectrics
    • Abell, T. and Maex, K. (2004) Damage minimized plasma pore sealing of microporous low-k dielectrics. Microelectron. Engng, 76, 16-19.
    • (2004) Microelectron. Engng , vol.76 , pp. 16-19
    • Abell, T.1    Maex, K.2
  • 97
    • 0036118847 scopus 로고    scopus 로고
    • Properties of porous HSQ-based films capped by plasma-enhanced chemical vapor deposition dielectric layers
    • Iacopi, F., Baklanov, M.R., Sleeckx, E., Conard, T., Bender, H., Meynen, H. and Maex, K. (2002) Properties of porous HSQ-based films capped by plasma-enhanced chemical vapor deposition dielectric layers. J. Vac. Sci. Technol., B, 20, 109-115.
    • (2002) J. Vac. Sci. Technol., B , vol.20 , pp. 109-115
    • Iacopi, F.1    Baklanov, M.R.2    Sleeckx, E.3    Conard, T.4    Bender, H.5    Meynen, H.6    Maex, K.7
  • 101
    • 20544471147 scopus 로고    scopus 로고
    • Impact of reductive N2/H2 plasma on porous low-dielectric constant SiCOH thin films
    • Cui, H., Carter, R.J., Moore, D.L., Peng, H.-G., Gidley, D.W. and Burke, P.A. (2005) Impact of reductive N2/H2 plasma on porous low-dielectric constant SiCOH thin films. J. Appl. Phys., 97, 113302/113301-113302/113308.
    • (2005) J. Appl. Phys. , vol.97
    • Cui, H.1    Carter, R.J.2    Moore, D.L.3    Peng, H.-G.4    Gidley, D.W.5    Burke, P.A.6
  • 106
    • 0032636121 scopus 로고    scopus 로고
    • Effects of hydrogen on electrical and chemical properties of low-k hydrogen silsesquioxane as an intermetal dielectric for nonetchback processes
    • Chang, T.C., Liu, P.T., Shih, F.Y. and Sze, S.M. (1999) Effects of hydrogen on electrical and chemical properties of low-k hydrogen silsesquioxane as an intermetal dielectric for nonetchback processes. Electrochem. Solid-State Lett., 2, 390-392.
    • (1999) Electrochem. Solid-State Lett. , vol.2 , pp. 390-392
    • Chang, T.C.1    Liu, P.T.2    Shih, F.Y.3    Sze, S.M.4
  • 107
    • 0036002398 scopus 로고    scopus 로고
    • Passivation effect on low-ΰ SiOC dielectrics by H2 plasma treatment
    • Kim, Y.-H., Kim, H.J., Kim, J.Y. and Lee, Y. (2002) Passivation effect on low-ΰ SiOC dielectrics by H2 plasma treatment. J. Korean Phys. Soc., 40, 94-98.
    • (2002) J. Korean Phys. Soc. , vol.40 , pp. 94-98
    • Kim, Y.-H.1    Kim, H.J.2    Kim, J.Y.3    Lee, Y.4
  • 108
    • 0035982571 scopus 로고    scopus 로고
    • Reduction of etching plasma damage on low dielectric constant fluorinated amorphous carbon films by multiple H2 plasma treatment
    • Shieh, J.-M., Tsai, K.-C., Dai, B.-T., Wu, Y.-C. and Wu, Y.-H. (2002) Reduction of etching plasma damage on low dielectric constant fluorinated amorphous carbon films by multiple H2 plasma treatment. J. Vac. Sci. Technol., B, 20, 1476-1481.
    • (2002) J. Vac. Sci. Technol., B , vol.20 , pp. 1476-1481
    • Shieh, J.-M.1    Tsai, K.-C.2    Dai, B.-T.3    Wu, Y.-C.4    Wu, Y.-H.5
  • 110
    • 2942655393 scopus 로고    scopus 로고
    • Interaction of hydrogen plasma with extreme low-k SiCOH dielectrics
    • Grill, A. and Patel, V. (2004) Interaction of hydrogen plasma with extreme low-k SiCOH dielectrics. J. Electrochem. Soc., 151, F133-F134.
    • (2004) J. Electrochem. Soc. , vol.151
    • Grill, A.1    Patel, V.2
  • 111
    • 27144524898 scopus 로고    scopus 로고
    • Hydrogen plasma effects on ultralow-k porous SiCOH dielectrics
    • Grill, A., Sternhagen, V., Neumayer, D. and Patel, V. (2005) Hydrogen plasma effects on ultralow-k porous SiCOH dielectrics. J. Appl. Phys., 98, 074502/074501-074502/074507.
    • (2005) J. Appl. Phys. , vol.98
    • Grill, A.1    Sternhagen, V.2    Neumayer, D.3    Patel, V.4
  • 115
    • 10644284066 scopus 로고    scopus 로고
    • Effect of silylation on triethoxyfluorosilane xerogel films by means of atmospheric pressure drying
    • Orozco-Teran, R.A., Gorman, B.P., Mueller, D.W., Baklanov, M.R. and Reidy, R.F. (2004) Effect of silylation on triethoxyfluorosilane xerogel films by means of atmospheric pressure drying. Thin Solid Films, 471, 145-153.
    • (2004) Thin Solid Films , vol.471 , pp. 145-153
    • Orozco-Teran, R.A.1    Gorman, B.P.2    Mueller, D.W.3    Baklanov, M.R.4    Reidy, R.F.5
  • 116
    • 39649102158 scopus 로고    scopus 로고
    • Hexamethyldisilazane vapor treatment of plasma damaged nanoporous methylsilsesquioxane films: structural and electrical characteristics
    • Rajagopalan, T., Lahlouh, B., Chari, I., Othman, M.T., Biswas, N., Toma, D. and Gangopadhyay, S. (2008) Hexamethyldisilazane vapor treatment of plasma damaged nanoporous methylsilsesquioxane films: structural and electrical characteristics. Thin Solid Films, 516, 3399- 3404.
    • (2008) Thin Solid Films , vol.516 , pp. 3399-3404
    • Rajagopalan, T.1    Lahlouh, B.2    Chari, I.3    Othman, M.T.4    Biswas, N.5    Toma, D.6    Gangopadhyay, S.7
  • 118
    • 0038608095 scopus 로고    scopus 로고
    • Microstructure and mechanical properties of surfactant templated nanoporous silica thin films: effect of methylsilylation
    • Chen, J.Y., Pan, F.M., Cho, A.T., Chao, K.J., Tsai, T.G., Wu, B.W., Yang, C.M. and Chang, L. (2003) Microstructure and mechanical properties of surfactant templated nanoporous silica thin films: effect of methylsilylation. J. Electrochem. Soc., 150, F123-F127.
    • (2003) J. Electrochem. Soc. , vol.150
    • Chen, J.Y.1    Pan, F.M.2    Cho, A.T.3    Chao, K.J.4    Tsai, T.G.5    Wu, B.W.6    Yang, C.M.7    Chang, L.8
  • 119
    • 34249871356 scopus 로고    scopus 로고
    • Restoration and pore sealing of plasma damaged porous organosilicate low k dielectrics with phenyl containing agents
    • Liu, J., Kim, W., Bao, J., Shi, H., Baek, W. and Ho, P.S. (2007) Restoration and pore sealing of plasma damaged porous organosilicate low k dielectrics with phenyl containing agents. J. Vac. Sci. Technol., B, 25, 906-912.
    • (2007) J. Vac. Sci. Technol., B , vol.25 , pp. 906-912
    • Liu, J.1    Kim, W.2    Bao, J.3    Shi, H.4    Baek, W.5    Ho, P.S.6
  • 121
    • 85111791793 scopus 로고    scopus 로고
    • Chemical repair of plasma damaged porous ultra low-ΰ SiOCH film using a vapor phase process
    • Oszinda, T., Schaller, M. and Schulz, S.E. (2010) Chemical repair of plasma damaged porous ultra low-ΰ SiOCH film using a vapor phase process. ECS Trans., 25, 19-30.
    • (2010) ECS Trans. , vol.25 , pp. 19-30
    • Oszinda, T.1    Schaller, M.2    Schulz, S.E.3
  • 127
    • 33751391983 scopus 로고
    • Zeolite and molecular sieve synthesis
    • Davis, M.E. and Lobo, R.F. (1992) Zeolite and molecular sieve synthesis. Chem. Mater., 4, 756-768.
    • (1992) Chem. Mater. , vol.4 , pp. 756-768
    • Davis, M.E.1    Lobo, R.F.2
  • 128
    • 0013385076 scopus 로고    scopus 로고
    • From microporous to mesoporous molecular sieve materials and their use in catalysis
    • Corma, A. (1997) From microporous to mesoporous molecular sieve materials and their use in catalysis. Chem. Rev., 97, 2373-2419.
    • (1997) Chem. Rev. , vol.97 , pp. 2373-2419
    • Corma, A.1
  • 130
    • 0001090327 scopus 로고
    • Silicalite-2, a silica analog of the aluminosilicate zeolite ZSM-11
    • Bibby, D.M., Milestone, N.B. and Aldridge, L.P. (1979) Silicalite-2, a silica analog of the aluminosilicate zeolite ZSM-11. Nature (London), 280, 664-665.
    • (1979) Nature (London) , vol.280 , pp. 664-665
    • Bibby, D.M.1    Milestone, N.B.2    Aldridge, L.P.3
  • 133
    • 84885746979 scopus 로고    scopus 로고
    • Dielectric layer including silicalite crystals and binder and method for producing same for microelectronic circuits
    • Patent 6,329,062
    • Gaynor, J.F. (2001) Dielectric layer including silicalite crystals and binder and method for producing same for microelectronic circuits. Patent 6,329,062.
    • (2001)
    • Gaynor, J.F.1
  • 134
    • 84885746979 scopus 로고    scopus 로고
    • Dielectric layer including silicalite crystals and binder and method for producing same for microelectronic circuits
    • Patent 6,566,243
    • Gaynor, J.F. (2003) Dielectric layer including silicalite crystals and binder and method for producing same for microelectronic circuits. Patent 6,566,243.
    • (2003)
    • Gaynor, J.F.1
  • 136
    • 33644554475 scopus 로고    scopus 로고
    • Interfacial adhesion of nanoporous zeolite thin films
    • Hu, L., Wang, J., Li, Z., Li, S. and Yan, Y. (2006) Interfacial adhesion of nanoporous zeolite thin films. J. Mater. Res., 21, 505-511.
    • (2006) J. Mater. Res. , vol.21 , pp. 505-511
    • Hu, L.1    Wang, J.2    Li, Z.3    Li, S.4    Yan, Y.5
  • 137
    • 0035797859 scopus 로고    scopus 로고
    • Pure silica zeolite films as low-k dielectrics by spin-on of nanoparticle suspensions
    • Wang, Z., Mitra, A., Wang, H., Huang, L. and Yan, Y. (2001) Pure silica zeolite films as low-k dielectrics by spin-on of nanoparticle suspensions. Adv. Mater., 13, 1463-1466.
    • (2001) Adv. Mater. , vol.13 , pp. 1463-1466
    • Wang, Z.1    Mitra, A.2    Wang, H.3    Huang, L.4    Yan, Y.5
  • 138
    • 4143142993 scopus 로고    scopus 로고
    • Evaluation of pore structure in pure silica zeolite MFI low-k thin films using positronium annihilation lifetime spectroscopy
    • Li, S., Sun, J., Li, Z., Peng, H., Gidley, D., Ryan, E.T. and Yan, Y. (2004) Evaluation of pore structure in pure silica zeolite MFI low-k thin films using positronium annihilation lifetime spectroscopy. J. Phys. Chem. B, 108, 11689-11692.
    • (2004) J. Phys. Chem. B , vol.108 , pp. 11689-11692
    • Li, S.1    Sun, J.2    Li, Z.3    Peng, H.4    Gidley, D.5    Ryan, E.T.6    Yan, Y.7
  • 139
    • 66549113044 scopus 로고    scopus 로고
    • Hydrofluoric-acid-resistant and hydrophobic pure-silica-zeolite MEL low-dielectric- constant films
    • Lew, C.M., Liu, Y., Day, B., Kloster, G.M., Tiznado, H., Sun, M., Zaera, F., Wang, J. and Yan, Y. (2009) Hydrofluoric-acid-resistant and hydrophobic pure-silica-zeolite MEL low-dielectric- constant films. Langmuir, 25, 5039-5044.
    • (2009) Langmuir , vol.25 , pp. 5039-5044
    • Lew, C.M.1    Liu, Y.2    Day, B.3    Kloster, G.M.4    Tiznado, H.5    Sun, M.6    Zaera, F.7    Wang, J.8    Yan, Y.9
  • 140
    • 0141508951 scopus 로고    scopus 로고
    • Ultra-low-k pure-silica zeolite MFI films using cyclodextrin as porogen
    • Li, S., Li, Z. and Yan, Y. (2003) Ultra-low-k pure-silica zeolite MFI films using cyclodextrin as porogen. Adv. Mater., 15, 1528-1531.
    • (2003) Adv. Mater. , vol.15 , pp. 1528-1531
    • Li, S.1    Li, Z.2    Yan, Y.3
  • 141
    • 8344262389 scopus 로고    scopus 로고
    • Effects of crystallinity in spin-on pure-silica-zeolite MFI low-dielectric-constant films
    • Li, Z., Li, S., Luo, H. and Yan, Y. (2004) Effects of crystallinity in spin-on pure-silica-zeolite MFI low-dielectric-constant films. Adv. Funct. Mater., 14, 1019-1024.
    • (2004) Adv. Funct. Mater. , vol.14 , pp. 1019-1024
    • Li, Z.1    Li, S.2    Luo, H.3    Yan, Y.4
  • 142
    • 19944384609 scopus 로고    scopus 로고
    • Pure-silica-zeolite MEL low-k films from nanoparticle suspensions
    • Li, Z., Lew, C.M., Li, S., Medina, D.I. and Yan, Y. (2005) Pure-silica-zeolite MEL low-k films from nanoparticle suspensions. J. Phys. Chem. B, 109, 8652-8658.
    • (2005) J. Phys. Chem. B , vol.109 , pp. 8652-8658
    • Li, Z.1    Lew, C.M.2    Li, S.3    Medina, D.I.4    Yan, Y.5
  • 144
    • 33846270639 scopus 로고    scopus 로고
    • Mechanical characterization of zeolite low dielectric constant thin films by nanoindentation
    • Johnson, M., Li, Z., Wang, J. and Yan, Y. (2007) Mechanical characterization of zeolite low dielectric constant thin films by nanoindentation. Thin Solid Films, 515, 3164-3170.
    • (2007) Thin Solid Films , vol.515 , pp. 3164-3170
    • Johnson, M.1    Li, Z.2    Wang, J.3    Yan, Y.4
  • 145
    • 54949125725 scopus 로고    scopus 로고
    • Evidence of large voids in pure-silica-zeolite low-k dielectrics synthesized by spin-on of nanoparticle suspensions
    • Eslava, S., Baklanov, M.R., Neimark, A.V., Iacopi, F., Kirschhock, C.E.A., Maex, K. and Martens, J.A. (2008) Evidence of large voids in pure-silica-zeolite low-k dielectrics synthesized by spin-on of nanoparticle suspensions. Adv. Mater., 20, 3110-3116.
    • (2008) Adv. Mater. , vol.20 , pp. 3110-3116
    • Eslava, S.1    Baklanov, M.R.2    Neimark, A.V.3    Iacopi, F.4    Kirschhock, C.E.A.5    Maex, K.6    Martens, J.A.7
  • 147
    • 47349118016 scopus 로고    scopus 로고
    • MEL-type pure-silica zeolite nanocrystals prepared by an evaporation-assisted two-stage synthesis method as ultra-low-k materials
    • Liu, Y., Sun, M., Lew, C.M., Wang, J. and Yan, Y. (2008) MEL-type pure-silica zeolite nanocrystals prepared by an evaporation-assisted two-stage synthesis method as ultra-low-k materials. Adv. Funct. Mater., 18, 1732-1738.
    • (2008) Adv. Funct. Mater. , vol.18 , pp. 1732-1738
    • Liu, Y.1    Sun, M.2    Lew, C.M.3    Wang, J.4    Yan, Y.5
  • 148
    • 77955381387 scopus 로고    scopus 로고
    • Comment on 'MEL-type pure-silica zeolite nanocrystals prepared by an evaporation- assisted two-stage synthesis method as ultra-low-k materials'
    • Eslava, S., Seo, J.W., Kirschhock, C.E.A., Baklanov, M.R., Maex, K. and Martens, J.A. (2010) Comment on 'MEL-type pure-silica zeolite nanocrystals prepared by an evaporation- assisted two-stage synthesis method as ultra-low-k materials'. Adv. Funct. Mater., 20, 2377-2379.
    • (2010) Adv. Funct. Mater. , vol.20 , pp. 2377-2379
    • Eslava, S.1    Seo, J.W.2    Kirschhock, C.E.A.3    Baklanov, M.R.4    Maex, K.5    Martens, J.A.6
  • 150
    • 34547679622 scopus 로고    scopus 로고
    • Ultraviolet-assisted curing of polycrystalline pure-silica zeolites: hydrophobization, functionalization, and cross-linking of grains
    • Eslava, S., Iacopi, F., Baklanov, M.R., Kirschhock, C.E.A., Maex, K. and Martens, J.A. (2007) Ultraviolet-assisted curing of polycrystalline pure-silica zeolites: hydrophobization, functionalization, and cross-linking of grains. J. Am. Chem. Soc., 129, 9288-9289.
    • (2007) J. Am. Chem. Soc. , vol.129 , pp. 9288-9289
    • Eslava, S.1    Iacopi, F.2    Baklanov, M.R.3    Kirschhock, C.E.A.4    Maex, K.5    Martens, J.A.6
  • 151
    • 68349099027 scopus 로고    scopus 로고
    • Young's modulus enhancement of mesoporous pure-silica-zeolite low-dielectric-constant films by ultraviolet and silylation treatments
    • Yoshino, T., Ohnuki, N., Hata, N. and Seino, Y. (2009) Young's modulus enhancement of mesoporous pure-silica-zeolite low-dielectric-constant films by ultraviolet and silylation treatments. Jpn. J. Appl. Phys., 48, 050210/050211-050210/050213.
    • (2009) Jpn. J. Appl. Phys. , vol.48
    • Yoshino, T.1    Ohnuki, N.2    Hata, N.3    Seino, Y.4
  • 152
    • 18244372435 scopus 로고    scopus 로고
    • Organic-functionalized pure-silica-zeolite MFI low-k films
    • Li, S., Li, Z., Medina, D., Lew, C. and Yan, Y. (2005) Organic-functionalized pure-silica-zeolite MFI low-k films. Chem. Mater., 17, 1851-1854.
    • (2005) Chem. Mater. , vol.17 , pp. 1851-1854
    • Li, S.1    Li, Z.2    Medina, D.3    Lew, C.4    Yan, Y.5
  • 154
    • 55849121526 scopus 로고    scopus 로고
    • Single step preparation of novel hydrophobic composite films for low-k applications
    • Zhu, Y., Mueller, T.E. and Lercher, J.A. (2008) Single step preparation of novel hydrophobic composite films for low-k applications. Adv. Funct. Mater., 18, 3427-3433.
    • (2008) Adv. Funct. Mater. , vol.18 , pp. 3427-3433
    • Zhu, Y.1    Mueller, T.E.2    Lercher, J.A.3
  • 156
    • 0001567739 scopus 로고    scopus 로고
    • Bridged bisimide polysilsesquioxane xerogels: new hybrid organic-inorganic materials
    • Hobson, S.T. and Shea, K.J. (1997) Bridged bisimide polysilsesquioxane xerogels: new hybrid organic-inorganic materials. Chem. Mater., 9, 616-623.
    • (1997) Chem. Mater. , vol.9 , pp. 616-623
    • Hobson, S.T.1    Shea, K.J.2
  • 157
    • 0022188542 scopus 로고
    • Ceramers: hybrid materials incorporating polymeric/oligomeric species with inorganic glasses by a sol-gel process
    • Huang, H.H., Orler, B. and Wilkes, G.L. (1985) Ceramers: hybrid materials incorporating polymeric/oligomeric species with inorganic glasses by a sol-gel process. 2. Effect of acid content on the final properties. Polym. Bull., 14, 557-564.
    • (1985) 2. Effect of acid content on the final properties. Polym. Bull. , vol.14 , pp. 557-564
    • Huang, H.H.1    Orler, B.2    Wilkes, G.L.3
  • 159
    • 0032182230 scopus 로고    scopus 로고
    • Inorganic/organic hybrid materials
    • Sharp, K.G. (1998) Inorganic/organic hybrid materials. Adv. Mater., 10, 1243-1248.
    • (1998) Adv. Mater. , vol.10 , pp. 1243-1248
    • Sharp, K.G.1
  • 160
    • 0001222706 scopus 로고    scopus 로고
    • Organic/inorganic hybrid network materials by the sol-gel approach
    • Wen, J. and Wilkes, G.L. (1996) Organic/inorganic hybrid network materials by the sol-gel approach. Chem. Mater., 8, 1667-1681.
    • (1996) Chem. Mater. , vol.8 , pp. 1667-1681
    • Wen, J.1    Wilkes, G.L.2
  • 166
    • 57849126742 scopus 로고    scopus 로고
    • Ultra low-k films derived from hyperbranched polycarbosilanes (HBPCS)
    • Rathore, J.S., Interrante, L.V. and Dubois, G. (2008) Ultra low-k films derived from hyperbranched polycarbosilanes (HBPCS). Adv. Funct. Mater., 18, 4022-4028.
    • (2008) Adv. Funct. Mater. , vol.18 , pp. 4022-4028
    • Rathore, J.S.1    Interrante, L.V.2    Dubois, G.3
  • 169
    • 34547350046 scopus 로고    scopus 로고
    • The effect of porogen on physical properties in MTMS-BTMSE spin-on organosilicates
    • Kim, B.R., Son, J.M. and Ko, M.J. (2007) The effect of porogen on physical properties in MTMS-BTMSE spin-on organosilicates. J. Mater. Sci., 42, 5381-5390.
    • (2007) J. Mater. Sci. , vol.42 , pp. 5381-5390
    • Kim, B.R.1    Son, J.M.2    Ko, M.J.3
  • 170
    • 33847743399 scopus 로고    scopus 로고
    • Effect of pore generating materials on the electrical and mechanical properties of porous low-k films
    • Kim, S., Char, K., Hahn, J., Lee, J.-K., Yoon, D.Y., Rhee, H.-W. and Jin, M.Y. (2007) Effect of pore generating materials on the electrical and mechanical properties of porous low-k films. Macromol. Res., 15, 1-4.
    • (2007) Macromol. Res. , vol.15 , pp. 1-4
    • Kim, S.1    Char, K.2    Hahn, J.3    Lee, J.-K.4    Yoon, D.Y.5    Rhee, H.-W.6    Jin, M.Y.7
  • 173
    • 18744409540 scopus 로고    scopus 로고
    • Spin-coated periodic mesoporous organosilica thin films-towards a new generation of low-dielectricconstant materials
    • Hatton, B.D., Landskron, K., Whitnall, W., Perovic, D.D. and Ozin, G.A. (2005) Spin-coated periodic mesoporous organosilica thin films-towards a new generation of low-dielectricconstant materials. Adv. Funct. Mater., 15, 823-829.
    • (2005) Adv. Funct. Mater. , vol.15 , pp. 823-829
    • Hatton, B.D.1    Landskron, K.2    Whitnall, W.3    Perovic, D.D.4    Ozin, G.A.5
  • 174
    • 0141924561 scopus 로고    scopus 로고
    • Periodic mesoporous organosilicas containing interconnected [Si(CH2)]3 rings
    • Landskron, K., Hatton, B.D., Perovic, D.D. and Ozin, G.A. (2003) Periodic mesoporous organosilicas containing interconnected [Si(CH2)]3 rings. Science, 302, 266-269 (2003).
    • (2003) Science , vol.302 , pp. 266-269
    • Landskron, K.1    Hatton, B.D.2    Perovic, D.D.3    Ozin, G.A.4
  • 175
    • 0034616781 scopus 로고    scopus 로고
    • Evaporation-induced self-assembly of hybrid bridged silsesquioxane film and particulate mesophases with integral organic functionality
    • Lu, Y., Fan, H., Doke, N., Loy, D.A., Assink, R.A., LaVan, D.A. and Brinker, C.J. (2000) Evaporation-induced self-assembly of hybrid bridged silsesquioxane film and particulate mesophases with integral organic functionality. J. Am. Chem. Soc., 122, 5258-5261.
    • (2000) J. Am. Chem. Soc. , vol.122 , pp. 5258-5261
    • Lu, Y.1    Fan, H.2    Doke, N.3    Loy, D.A.4    Assink, R.A.5    LaVan, D.A.6    Brinker, C.J.7
  • 180
    • 79959935822 scopus 로고    scopus 로고
    • Application of the protection/deprotection strategy to the science of porous materials, Adv
    • Frot, T., Volksen, W., Purushothaman, S., Bruce, R.L., and Dubois, G. (2011) Application of the protection/deprotection strategy to the science of porous materials, Adv. Mater., 23, 2828.
    • (2011) Mater. , vol.23 , pp. 2828
    • Frot, T.1    Volksen, W.2    Purushothaman, S.3    Bruce, R.L.4    Dubois, G.5


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