Rapid repair of plasma ash damage in low-k dielectrics using supercritical CO 2

Journal of Vacuum Science and Technology B: Microelectronics and Nanometer Structures

Volumn 22, Issue 3, 2004, Pages 1210-1212

  Gorman, B P ^a   Orozco Teran, R A ^a   Zhang, Z ^a   Matz, P D ^b   Mueller, D W ^c   Reidy, R F ^a  

^a Center for Advanced Research and Technology   (United States)

^b TEXAS INSTRUMENTS   (United States)

^c UNIVERSITY OF NORTH TEXAS   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

PLASMA ASH DAMAGE; SILYLATION; SUPERCRITICAL REACTORS; WET ETCHING;

ABSORPTION; CARBON DIOXIDE; ETCHING; HYDROPHOBICITY; PERMITTIVITY; PLASMA THEORY; SCANNING ELECTRON MICROSCOPY; SOLUTIONS; SUPERCRITICAL FLUIDS;

AROMATIC COMPOUNDS;

EID: 3242716917     PISSN: 10711023     EISSN: None     Source Type: Journal    
DOI: None     Document Type: Article

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