UV curing effects on glass structure and mechanical properties of organosilicate low-k thin films

2006 International Interconnect Technology Conference, IITC

Volumn , Issue , 2006, Pages 149-151

  Gage, David M ^a   Guyer, Eric P ^a   Stebbins, Jonathan F ^b   Cui, Zhenjiang ^c   Al Bayati, Amir ^c   Demos, Alex ^c   MacWilliams, Kenneth P ^c   Dauskardt, Reinhold H ^a  

^a Stanford University   (United States)

^b STANFORD UNIVERSITY   (United States)

^c APPLIED MATERIALS INC   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

CARBON-DOPED OXIDE; COHESIVE FRACTURES; GLASS STRUCTURES; INTERNATIONAL INTERCONNECT TECHNOLOGY CONFERENCE; LOW- K FILMS; ORGANO SILICATES; ORGANOSILICATE THIN FILMS; PROMISING TECHNIQUE; ULTRA-VIOLET; UV CURING;

CARBON FILMS; DRYING; ELECTRIC CURRENTS; FRACTURE FIXATION; GLASS; MECHANICAL PROPERTIES; OXIDE FILMS; SILICON; TECHNOLOGY; THICK FILMS; THIN FILMS;

CURING;

EID: 50249102277     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/IITC.2006.1648673     Document Type: Conference Paper

References (6)

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