Property modifications of nanoporous pSiCOH dielectrics to enhance resistance to plasma-induced damage

Journal of Applied Physics

Volumn 104, Issue 9, 2008, Pages

  Ryan, E Todd ^a   Gates, Stephen M ^b   Grill, Alfred ^b   Molis, Steven ^c   Flaitz, Philip ^c   Arnold, John ^d   Sankarapandian, Muthumanickam ^d   Cohen, Stephan A ^b   Ostrovski, Yuri ^b   Dimitrakopoulos, Christos ^b  

^a ADVANCED MICRO DEVICES   (United States)

^b IBM T J WATSON RESEARCH CENTER   (United States)

^c IBM MICROELECTRONICS   (United States)

^d IBM   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

CARBON FILMS; DIELECTRIC FILMS; FILMS; INTEGRATED CIRCUITS; PLASMAS; SILICON;

CARBON CONTENTS; CHEMICAL COMPOSITIONS; DIELECTRIC CONSTANTS; INTERCONNECT DIELECTRICS; NANOFABRICATION; NANOPOROUS; PLASMA DAMAGES; PLASMA PROCESSES; PLASMA-INDUCED DAMAGES; SICOH FILMS;

DIELECTRIC MATERIALS;

EID: 56349169512     PISSN: 00218979     EISSN: None     Source Type: Journal    
DOI: 10.1063/1.3006438     Document Type: Article

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