A carbon-restoring silylation process for low-k dielectric repair

Solid State Technology

Volumn 50, Issue 7, 2007, Pages 79-86

  Bhanap, A ^a,e   Korolev, B ^a,e   Nitta, S ^b   Purushothaman, S ^b   Bonilla, G ^c   Ryan, E T ^d,f  

^a Honeywell International Inc   (United States)

^b IBM T J WATSON RESEARCH CENTER   (United States)

^c IBM   (United States)

^d AMD and ASTA Alliance   (United States)

^e HONEYWELL   (United States)

^f ADVANCED MICRO DEVICES   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

CARBON-RESTORING SILYLATION PROCESS; SILYLATION REACTION;

LOGIC DEVICES; PERMITTIVITY; POROUS MATERIALS; REPAIR;

DIELECTRIC DEVICES;

EID: 34547792853     PISSN: 0038111X     EISSN: None     Source Type: Trade Journal    
DOI: None     Document Type: Article

References (8)

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8. N. Nakamura et al., Proc. of Advanced Metallization Conference 2005, p. 707, 2005.