Robust multilevel interconnects with a Nano-Clustering porous low-k (k<2.3)

Proceedings of the IEEE 2004 International Interconnect Technology Conference

Volumn , Issue , 2004, Pages 175-177

  Nakamura, Tomoji ^a   Nakashima, Akira ^b  

^a FUJITSU LABORATORIES LTD   (Japan)

^b Catalysts/Chemicals Ind Co Ltd   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

CAPACITANCE; DIELECTRIC MATERIALS; ELECTRIC RESISTANCE; FABRICATION; NANOSTRUCTURED MATERIALS; PERMITTIVITY; POROUS MATERIALS; SILICA; SPIN COATING;

COMPATIBILITY; MESOPORES; PRESSURE TEMPERATURE HUMIDITY STRESS (PTHS); THERMAL CYCLE (TC);

OPTICAL INTERCONNECTS;

EID: 8644232676     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

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