Application of the protection/deprotection strategy to the science of porous materials

Advanced Materials

Volumn 23, Issue 25, 2011, Pages 2828-2832

  Frot, Theo ^a   Volksen, Willi ^a   Purushothaman, Sampath ^b   Bruce, Robert ^b   Dubois, Geraud ^a  

^a IBM ALMADEN RESEARCH CENTER   (United States)

^b IBM T J WATSON RESEARCH CENTER   (United States)

Author keywords

composite materials; dielectrics; electronic processes; electronic structures; porous materials; thin films

Indexed keywords

ELECTRONIC PROCESS; MATERIALS PROCESSING; SELECTIVE PROTECTION; ULTRALOW-K;

ELECTRONIC STRUCTURE; ORGANIC POLYMERS; POROUS MATERIALS;

POROSITY;

ETHYLENE; ETHYLENE DERIVATIVE; POLYMER; SILICON;

ARTICLE; ARTIFICIAL MEMBRANE; CHEMISTRY; MATERIALS TESTING; PARTICLE SIZE; POROSITY; SCIENCE; SURFACE PROPERTY;

ETHYLENES; MATERIALS TESTING; MEMBRANES, ARTIFICIAL; PARTICLE SIZE; POLYMERS; POROSITY; SCIENCE; SILICON; SURFACE PROPERTIES;

EID: 79959935822     PISSN: 09359648     EISSN: 15214095     Source Type: Journal    
DOI: 10.1002/adma.201100569     Document Type: Article

References (22)

1. P. Kocienski, Protecting Groups, Georg Thieme Verlag, Stuttgart, Germany 2003.
2. P. Wuts, T. Greene, Greene's protective groups in organic synthesis, John Wiley and Sons, Hoboken, NJ 2007.
3. W. Volksen, R. D. Miller, G. Dubois, Chem. Rev. 2010, 110, 56.
4. International technology Roadmap for Semiconductors, accessed April 2011.
5. L. Nicole, C. Boissiere, D. Grosso, A. Quach, C. Sanchez, J. Mater. Chem. 2005, 15, 3598.
6. R. Van Zee, G. Pomrenke, H. Evans, Nanotechnology-Enabled Sensing, accessed April 2011.
7. M. Darnon, T. Chevolleau, T. David, J. Ducote, N. Posseme, R. Bouyssou, F. Bailly, D. Perret, O. Joubert, J. Vac. Sci. Technol., B 2010, 28, 149.
8. F. Iacopi, J. Choi, K. Terashima, P. Rice, G. Dubois, Phys. Chem. Chem. Phys. 2011, 13, 2634.
9. T. Abell, K. Maex, Microelectron. Eng. 2004, 76, 16.
10. A. Bhanap, B. Korolev, S. Nitta, S. Purushothaman, G. Bonilla, E. T. Ryan, Solid State Technol. 2007, 50, 79.
11. V. Jousseaume, L. Favennec, A. Zenasni, G. Passemard, Appl. Phys. Lett. 2006, 88, 182908.
12. R. J. O. M. Hoofman, V. H. Nguyen, V. Arnal, M. Broekaart, L. G. Gosset, W. F. A. Besling, M. Fayolle, F. Iacopi, in Dielectric Films for Advanced Microelectronics, (Eds:, M. Baklanov, K. Maex, M. Green,), Wiley, New York 2007, 199.
13. S. M. Gates, G. Dubois, E. T. Ryan, A. Grill, M. Liu, D. Gidley, J. Electrochem. Soc. 2009, 156, G156.
14. G. Dubois, W. Volksen, T. Magbitang, R. D. Miller, D. M. Gage, R. H. Dauskardt, Adv. Mater. 2007, 19, 3989.
15. G. Dubois, W. Volksen, T. Magbitang, M. H. Sherwood, R. D. Miller, D. M. Gage, R. H. Dauskardt, J. Sol-Gel Sci. Technol. 2008, 48, 187.
16. J. S. Rathore, L. V. Interrante, G. Dubois, Adv. Funct. Mater. 2008, 18, 4022.
17. M. Oliver, G. Dubois, R. Dauskardt, presented at IEEE Int. Interconnect Technol. Conf., Burlingame, CA, June 2010.
18. M. S. Oliver, G. Dubois, M. Sherwood, D. M. Gage, R. H. Dauskardt, Adv. Funct. Mater. 2010, 20, 2884.
19. E. Huang, M. F. Toney, W. Volksen, D. Mecerreyes, P. Brock, H. C. Kim, C. J. Hawker, J. L. Hedrick, V. Y. Lee, T. Magbitang, R. D. Miller, L. B. Lurio, Appl. Phys. Lett. 2002, 81, 2232.
20. J. H. Yim, M. R. Baklanov, D. W. Gidley, H. Peng, H. D. Jeong, L. S. Pu, J. Phys. Chem. B 2004, 108, 8953.
21. J. Baggerman, R. Visser, E. Collart, J. Appl. Phys. 1994, 75, 758.
22. C. I. Oh, J. K. Lee, M. S. Kim, K. H. Yoon, H. S. Cheon, N. Tokareva, J. Y. Song, J. S. Kim, T. W. Chang, presented at Adv. Resist Mater. Process. Technol. XXV, San Jose, CA, February 2008.