Superior mechanical properties of dense and porous organic/inorganic hybrid thin films

Journal of Sol-Gel Science and Technology

Volumn 48, Issue 1-2, 2008, Pages 187-193

  Dubois, Geraud ^a   Volksen, Willi ^a   Magbitang, Teddie ^a   Sherwood, Mark H ^a   Miller, Robert D ^a   Gage, David M ^b   Dauskardt, Reinhold H ^b  

^a IBM ALMADEN RESEARCH CENTER   (United States)

^b Stanford University   (United States)

Author keywords

Dielectric constant; Fracture energy; Oxycarbosilanes; Porosity; Sol?gel; Thin films; Young?s modulus

Indexed keywords

BRITTLE FRACTURE; CARBON FILMS; CHEMICAL PROPERTIES; COLLOIDS; FRACTURE; FRACTURE FIXATION; GELATION; GELS; MATERIALS PROPERTIES; MICROELECTRONICS; NONMETALS; POROUS MATERIALS; SILICON; SOL-GEL PROCESS; SOLS; THICK FILMS;

BRIDGING UNITS; CHEMICAL NATURE; DIELECTRIC CONSTANT; ELECTRONIC DEVICES; ENERGY VALUES; FRACTURE ENERGY; INORGANIC MATERIALS; INSULATING LAYERS; MICROELECTRONICS INDUSTRY; ORGANIC/INORGANIC HYBRIDS; ORGANICS; ORGANO-SILICATE GLASSES; ORGANOSILICATES; OXYCARBOSILANES; POROSITY; SILICON ATOMS; SOL?GEL; THIN-FILMS; YOUNG?S MODULUS;

MECHANICAL PROPERTIES;

EID: 51949105414     PISSN: 09280707     EISSN: None     Source Type: Journal    
DOI: 10.1007/s10971-008-1776-2     Document Type: Article

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