Interface engineering for high interfacial strength between SiCOH and porous SiCOH interconnect dielectrics and diffusion caps

Journal of Applied Physics

Volumn 103, Issue 5, 2008, Pages

  Grill, A ^a   Edelstein, D ^a   Lane, M ^a,c   Patel, V ^a   Gates, S ^a   Restaino, D ^b   Molis, S ^b  

^a IBM T J WATSON RESEARCH CENTER   (United States)

^b IBM RESEARCH   (United States)

^c EMORY AND HENRY COLLEGE   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

COHESIVE STRENGTH; DIELECTRIC STACK; INTERCONNECT STRUCTURES; INTERFACIAL STRENGTH;

ADHESION; DIELECTRIC MATERIALS; INTERFACIAL ENERGY; MICROPROCESSOR CHIPS;

POROUS SILICON;

EID: 40849118377     PISSN: 00218979     EISSN: None     Source Type: Journal    
DOI: 10.1063/1.2844483     Document Type: Article

References (10)

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