Restoration and pore sealing of plasma damaged porous organosilicate low k dielectrics with phenyl containing agents

Journal of Vacuum Science and Technology B: Microelectronics and Nanometer Structures

Volumn 25, Issue 3, 2007, Pages 906-912

  Liu, J ^a   Kim, W ^a   Bao, J ^a   Shi, H ^a   Baek, W ^a   Ho, P S ^a  

^a The University of Texas at Austin   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ADSORPTION; HYDROPHOBICITY; ORGANOMETALLICS; PERMITTIVITY; RESTORATION; SILICATES; TRANSMISSION ELECTRON MICROSCOPY;

BARRIER INTERFACES; PHENYL CONTAINING AGENTS; PORE SEALING; SURFACE HYDROPHOBICITY;

DIELECTRIC MATERIALS;

EID: 34249871356     PISSN: 10711023     EISSN: None     Source Type: Journal    
DOI: 10.1116/1.2738489     Document Type: Article

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