Cleaning status on low-k dielectric in advanced VLSI interconnect: Characterisation and principal issues

Microelectronic Engineering

Volumn 57-58, Issue , 2001, Pages 621-627

  Louis, D ^a   Beverina, A ^b   Arvet, C ^b   Lajoinie, E ^b   Peyne, C ^c   Holmes, D ^c   Maloney, D ^c  

^a CEA LETI   (France)

^b STMICROELECTRONICS   (France)

^c EKC Technology Inc   (United States)

Author keywords

Chemical analysis; Interconnect cleaning; Low k dielectric

Indexed keywords

AUGER ELECTRON SPECTROSCOPY; CHEMICAL ANALYSIS; CLEANING; DIELECTRIC MATERIALS; SECONDARY ION MASS SPECTROMETRY; SOLUTIONS; TRANSMISSION ELECTRON MICROSCOPY;

INTERCONNECT CLEANINGS;

VLSI CIRCUITS;

EID: 0035450040     PISSN: 01679317     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0167-9317(01)00548-2     Document Type: Article

References (8)