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Volumn , Issue , 2004, Pages 208-210
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Cu/ULK integration using a post integration porogen removal approach
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Author keywords
[No Author keywords available]
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Indexed keywords
CHEMICAL BONDS;
CHEMICAL MECHANICAL POLISHING;
COPPER;
DIELECTRIC MATERIALS;
ETCHING;
NANOSTRUCTURED MATERIALS;
PERMITTIVITY;
POROSITY;
POROUS MATERIALS;
PYROLYSIS;
SCANNING ELECTRON MICROSCOPY;
THERMOGRAVIMETRIC ANALYSIS;
DAMASCENE STRUCTURE;
NANOPARTICLES;
POROGEN MATERIALS;
INTERCONNECTION NETWORKS;
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EID: 8644288284
PISSN: None
EISSN: None
Source Type: Conference Proceeding
DOI: None Document Type: Conference Paper |
Times cited : (16)
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References (7)
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