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Volumn , Issue , 2004, Pages 208-210

Cu/ULK integration using a post integration porogen removal approach

Author keywords

[No Author keywords available]

Indexed keywords

CHEMICAL BONDS; CHEMICAL MECHANICAL POLISHING; COPPER; DIELECTRIC MATERIALS; ETCHING; NANOSTRUCTURED MATERIALS; PERMITTIVITY; POROSITY; POROUS MATERIALS; PYROLYSIS; SCANNING ELECTRON MICROSCOPY; THERMOGRAVIMETRIC ANALYSIS;

EID: 8644288284     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper
Times cited : (16)

References (7)
  • 1
    • 8644279463 scopus 로고    scopus 로고
    • ITRS, Semiconductor Industry Association, San Jose, CA 1999
    • ITRS, Semiconductor Industry Association, San Jose, CA 1999
  • 2
    • 8644273848 scopus 로고    scopus 로고
    • ITRS, Semiconductor Industry Association, San Jose, CA 2003
    • ITRS, Semiconductor Industry Association, San Jose, CA 2003


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.