Low dielectric constant materials for interlayer dielectric (Invited paper)

Microelectronic Engineering

Volumn 40, Issue 1, 1998, Pages 1-19

  Treichel, H ^a   Ruhl, G ^a   Ansmann, P ^a   Wurl R ^a   Muller Ch ^a   Dietlmeier, M ^b  

^a Fraunhofer Institut fur Festkorpertechnologie   (Germany)

^b TECHNICAL UNIVERSITY OF MUNICH   (Germany)

Author keywords

CVD; Intermetal dielectric; Low dielectric constant; Polymers; RC delay; Spin on materials

Indexed keywords

CHEMICAL VAPOR DEPOSITION; INTERMETALLICS; MICROELECTRONICS; PERMITTIVITY; POLYMERS;

INTERLAYER DIELECTRICS; SPIN ON MATERIALS;

DIELECTRIC MATERIALS;

EID: 0347662772     PISSN: 01679317     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0167-9317(97)00185-8     Document Type: Article

References (50)

1. S. Bothra et al., IEEE Transactions on Electr. Dev. 40(3) (1993) 591.
2. S.P. Murarka, Solid State Technology (March, 1996) 83.
3. C.H. Ting, T.E. Seidel, Mat. Res. Soc. Symp. 381 (1995) 3.
4. Semiconductor Industry Association, The National Technology Roadmap for Semiconductors, 1994.
5. M.T. Bohr, Solid State Technology 9 (1996) 105.
6. Ikeda et al., J. Electronic Mat. 19(1) (1990) 45.
7. Hatanaka, Y. Mizushima, O. Hataishi, Y. Furumara, Proc. IEEE VLSI Multilevel Interconnection Conf., 435.
8. A. Saproo, D.R. Denison, J. Lam, DUMIC Conf. (1996) 239.
9. Machida, H. Oikawa, J. Vac. Sci. Technol. B4 (1986) 818.
10. O.A. Popov, H. Waldron, J. Vac. Sci. Technol. A7 (1989) 914.
11. T.V. Herak, T.T. Chau et al., J. Appl. Phys. 65 (1989) 2457.
12. T.-M. Lu, S.P. Murarka, T.-S. Kuan, C.H. Ting, MRS Symposium Proc. 381, 239.
13. Y. Nagasaki, H. Miyajima, Y. Nishiyama, N. Hayasaka, H. Okano, Ext. 1994 MRS Fall Meeting, Oa3.33.
14. H. Miyajima, R. Katsumata, Y. Nakasaki, N. Hayasaka, H. Okano, VMIC Conf. (1995) 391.
15. P. Ansmann, R. Würl, unpublished results.
16. G. Passemard, P. Fugier, P. Noel, F. Pires, O. Demolliens, DUMIC Conf. (1996) 145.
17. N. Hayasaka, H. Miyajima, Y. Nakasaki, R. Katsumata, MRS Conf. Proc. ULSI XI (1996) 81.
18. T. Tamura, Y. Inoue, M. Satoh, H. Yoshitaka, J. Sakai, DUMIC Conf. (1996) 231.
19. D. Herminghause et al., Appl. Phys. Letters 59 (1991) 1043.
20. P. Singer, Semiconductor International (November, 1996) 60.
21. C. Jin, S. List, W.W. Lee, C. Lee, J.D. Luttmer, R. Havemann, D. Smith, T. Ramos, A. Masksra, Abstr. Adv. Met. Interconn. Systems ULSI Appl., Boston, 1996.
22. J. Fricke, Phys. BI. 51 (1995) 935.
23. D.M. Smith, D. Stein, J.M. Anderson, W. Ackermann, J. Non-Cryst. Solids 186 (1995) 104.
24. P.K. Wu, Mat. Res. Soc. Symp. 385 (1995) 79.
25. C.A. Chang, Appl. Phys. Lett. 51 (1987) 1236.
26. P. Aurog, L. Auvrag, L. Leger, Phys. Rev. Lett. 66 (1991) 719.
27. H. Linde, R.T. Gleason, J. Polym. Sci. Polym. Chem. 22 (1984) 3043.
28. P. Buchwalter, Proc. 7th Du Pont Symp. on Polyimides in Microelectronics (1996) 531.
29. L.J. Buckley et al., Mat. Res. Soc. Proc. 381 (1995) 111.
30. R.M. Geffken, IEDM Technical Digest, 542 (1983).
31. N.H. Hendricks, Solid State Technology (July, 1995) 117.
32. F.W. Mercer et al., US Patent Nos. 5 114 780, 5 115 082, assigned to Allied Signal.
33. W. Mercer, et al., Proc. 1990 Intl. Electronics Packaging Conf., Orlando, FL (Sept. 1990) p. 1042.
34. S. Mumby, J. Electr. Mat. 18(2) (1989) 241.
35. H. Treichel et al., Ceramics Int. 22(5) (1996) 435.
36. N.H. Hendricks, K.S.Y. Lau, A.R. Smith, W.B. Wan, Mat. Res. Soc. Symp. 385 (1995) 59.
37. B. Sillion, G. Rabilloud, J. Garapon, O. Gain, J. Vallet, Mat. Res. Soc. Symp. 385 (1995) 93.
38. G. Maier, O. Nuyken, R. Hecht, J.M. Schneider, Mat. Res. Soc. Symp. 443 (in press).
39. D.W. van Krevelen, Properties of Polymers, Elsevier, Amsterdam, 1976, p. 231.
40. O. Nuyken, M.B. Leitner, G. Maier, Makromol. Chem. 192 (1991) 3071.
41. J.V. Crivello, Mat. Res. Soc. Symp. 385 (1995) 51.
42. R.A. Shick, Proc. IEEE Multi-Chip Module Conf. (1996).
43. V. Liberman, V. Malba, A.F. Bernhardt, Mat. Res. Soc. Symp. 443 (in press).
44. C. Chiang, A.S. Mack, C. Pan, Y.L. Ling, D.B. Fraser, Mat. Res. Soc. Symp. 385 (1995) 123.
45. S. Zecchin, R. Tomat, G. Schiavon, G. Zotti, Synth. Met. 25 (1988) 393.
46. C.-I. Lang, G.-R. Yang, J.A. Moore, T.-M. Lu, Mat. Res. Soc. Symp. 385 (1995) 45.
47. P.R. Resnick, Polym. Prepr. 31 (1990) 312.
48. R. Singh, R. Sharangpani, DUMIG Conf. (1996) p. 78.
49. S.C. Sun, J.W. Sze, T. Rosenmayer, A. Wu, Mat. Res. Soc. Symp. 443 (in press).
50. J. Wang, R.A. Olson, W.F. Beach, DUMIC Conf. 207 (1996).