Ultra low-k integration solutions using GCIB processing

Proceedings of the IEEE 2004 International Interconnect Technology Conference

Volumn , Issue , 2004, Pages 193-195

  White, Brian ^a,b   Book, Greg ^c   Hautala, John ^d   Tabat, Martin ^d  

^a SEMATECH   (United States)

^b ADVANCED MICRO DEVICES   (United States)

^c INTEL CORPORATION   (United States)

^d Epion Corporation   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

GAS CLUSTER ION BEAMS (GCIB); LOW-K DIELECTRICS; LOW-K MATERIALS; MICRO LOADING;

ETCHING; ION BEAMS; KINETIC ENERGY; OPTICAL INTERCONNECTS; PLASMA APPLICATIONS; POROUS MATERIALS; SILICA;

DIELECTRIC MATERIALS;

EID: 8644242317     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

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