-
2
-
-
0344822645
-
-
1433-7851, 10.1002/(SICI)1521-3773(19991115)38:22<3268::AID-ANIE32683. 0.CO;2-U
-
A. K. Cheetham, G. Ferey, and T. Loiseau, Angew. Chem., Int. Ed. 1433-7851 38, 3268 (1999). 10.1002/(SICI)1521-3773(19991115)38:22<3268::AID- ANIE32683.0.CO;2-U
-
(1999)
Angew. Chem., Int. Ed.
, vol.38
, pp. 3268
-
-
Cheetham, A.K.1
Ferey, G.2
Loiseau, T.3
-
3
-
-
0034324763
-
-
0956-5663, 10.1016/S0956-5663(00)00088-9
-
T. A. Desai, D. J. Hansford, L. Leoni, M. Essenpreis, and M. Ferrari, Biosens. Bioelectron. 0956-5663 15, 453 (2000). 10.1016/S0956-5663(00)00088-9
-
(2000)
Biosens. Bioelectron.
, vol.15
, pp. 453
-
-
Desai, T.A.1
Hansford, D.J.2
Leoni, L.3
Essenpreis, M.4
Ferrari, M.5
-
4
-
-
0036927604
-
-
0959-9428, 10.1039/b207390k
-
W. -C. Chen, L. -H. Lee, B. -F. Chen, and C. -T. Yen, J. Mater. Chem. 0959-9428 12, 3644 (2002). 10.1039/b207390k
-
(2002)
J. Mater. Chem.
, vol.12
, pp. 3644
-
-
Chen, W.-C.1
Lee, L.-H.2
Chen, B.-F.3
Yen, C.-T.4
-
5
-
-
34250628040
-
Thermally stable antireflective coatings based on nanoporous organosilicate thin films
-
DOI 10.1021/la070003q
-
S. Kim, J. Cho, and K. Char, Langmuir 0743-7463 23, 6737 (2007). 10.1021/la070003q (Pubitemid 46943503)
-
(2007)
Langmuir
, vol.23
, Issue.12
, pp. 6737-6743
-
-
Kim, S.1
Cho, J.2
Char, K.3
-
7
-
-
29044435187
-
-
0884-2914, 10.1557/JMR.2005.0079
-
E. P. Guyer and R. H. Dauskardt, J. Mater. Res. 0884-2914 20, 680 (2005). 10.1557/JMR.2005.0079
-
(2005)
J. Mater. Res.
, vol.20
, pp. 680
-
-
Guyer, E.P.1
Dauskardt, R.H.2
-
8
-
-
33744501237
-
Fracture of nanoporous methyl silsesquioxane thin-film glasses
-
DOI 10.1557/jmr.2006.0106
-
E. P. Guyer, M. Patz, and R. H. Dauskardt, J. Mater. Res. 0884-2914 21, 882 (2006). 10.1557/jmr.2006.0106 (Pubitemid 43805176)
-
(2006)
Journal of Materials Research
, vol.21
, Issue.4
, pp. 882-894
-
-
Guyer, E.P.1
Patz, M.2
Dauskardt, R.H.3
-
9
-
-
41549102521
-
-
0021-8979, 10.1063/1.2894727
-
T. Kim, N. Tsuji, N. Kemeling, K. Matsushita, D. Chumakov, H. Geisler, E. Zschech, and R. H. Dauskardt, J. Appl. Phys. 0021-8979 103, 064108 (2008). 10.1063/1.2894727
-
(2008)
J. Appl. Phys.
, vol.103
, pp. 064108
-
-
Kim, T.1
Tsuji, N.2
Kemeling, N.3
Matsushita, K.4
Chumakov, D.5
Geisler, H.6
Zschech, E.7
Dauskardt, R.H.8
-
10
-
-
54049084560
-
-
0021-8979, 10.1063/1.2999637
-
T. Kim, N. Tsuji, K. Matsushita, N. Kobayashi, D. Chumakov, H. Geisler, E. Zschech, and R. H. Dauskardt, J. Appl. Phys. 0021-8979 104, 074113 (2008). 10.1063/1.2999637
-
(2008)
J. Appl. Phys.
, vol.104
, pp. 074113
-
-
Kim, T.1
Tsuji, N.2
Matsushita, K.3
Kobayashi, N.4
Chumakov, D.5
Geisler, H.6
Zschech, E.7
Dauskardt, R.H.8
-
11
-
-
50849122022
-
-
0021-8979, 10.1063/1.2968438
-
D. M. Gage, J. F. Stebbins, L. Peng, Z. Cui, A. Al-Bayati, K. P. MacWilliams, H. M'Saad, and R. H. Dauskardt, J. Appl. Phys. 0021-8979 104, 043513 (2008). 10.1063/1.2968438
-
(2008)
J. Appl. Phys.
, vol.104
, pp. 043513
-
-
Gage, D.M.1
Stebbins, J.F.2
Peng, L.3
Cui, Z.4
Al-Bayati, A.5
MacWilliams, K.P.6
M'Saad, H.7
Dauskardt, R.H.8
-
12
-
-
51449115467
-
-
1359-6454, 10.1016/j.actamat.2008.06.007
-
Y. Lin, Y. Xiang, T. Y. Tsui, and J. J. Vlassak, Acta Mater. 1359-6454 56, 4932 (2008). 10.1016/j.actamat.2008.06.007
-
(2008)
Acta Mater.
, vol.56
, pp. 4932
-
-
Lin, Y.1
Xiang, Y.2
Tsui, T.Y.3
Vlassak, J.J.4
-
13
-
-
33645229819
-
-
0021-8979, 10.1063/1.2178393
-
F. Iacopi, Y. Travaly, B. Eyckens, C. Waldfried, T. Abell, E. P. Guyer, D. M. Gage, R. H. Dauskardt, T. Sajavaara, K. Houthoofd, P. Grobet, P. Jacobs, and K. Maex, J. Appl. Phys. 0021-8979 99, 053511 (2006). 10.1063/1.2178393
-
(2006)
J. Appl. Phys.
, vol.99
, pp. 053511
-
-
Iacopi, F.1
Travaly, Y.2
Eyckens, B.3
Waldfried, C.4
Abell, T.5
Guyer, E.P.6
Gage, D.M.7
Dauskardt, R.H.8
Sajavaara, T.9
Houthoofd, K.10
Grobet, P.11
Jacobs, P.12
Maex, K.13
-
14
-
-
55349085080
-
-
(Materials Research Society, Warrendale, PA)
-
D. M. Gage, K. S. Yim, A. Al-Bayati, A. Demos, H. M'Saad, and R. H. Dauskardt, Proceedings of Advanced Metallization Conference (Materials Research Society, Warrendale, PA, 2008), p. 433.
-
(2008)
Proceedings of Advanced Metallization Conference
, pp. 433
-
-
Gage, D.M.1
Yim, K.S.2
Al-Bayati, A.3
Demos, A.4
M'Saad, H.5
Dauskardt, R.H.6
-
16
-
-
33846700734
-
Thermomechanical properties of thin organosilicate glass films treated with ultraviolet-assisted cure
-
DOI 10.1016/j.actamat.2006.10.008, PII S1359645406007282
-
F. Iacopi, G. Beyer, Y. Travaly, C. Waldfried, D. M. Gage, R. H. Dauskardt, K. Houthoofd, P. Jacobs, P. Adriaensens, K. Schulze, S. E. Schulz, S. List, and G. Carlotti, Acta Mater. 55, 1407 (2007). 10.1016/j.actamat.2006.10. 008 (Pubitemid 46188414)
-
(2007)
Acta Materialia
, vol.55
, Issue.4
, pp. 1407-1414
-
-
Iacopi, F.1
Beyer, G.2
Travaly, Y.3
Waldfried, C.4
Gage, D.M.5
Dauskardt, R.H.6
Houthoofd, K.7
Jacobs, P.8
Adriaensens, P.9
Schulze, K.10
Schulz, S.E.11
List, S.12
Carlotti, G.13
-
17
-
-
40849118377
-
-
0021-8979, 10.1063/1.2844483
-
A. Grill, D. Edelstein, M. Lane, V. Patel, S. Gates, D. Restaino, and S. Molis, J. Appl. Phys. 0021-8979 103, 054104 (2008). 10.1063/1.2844483
-
(2008)
J. Appl. Phys.
, vol.103
, pp. 054104
-
-
Grill, A.1
Edelstein, D.2
Lane, M.3
Patel, V.4
Gates, S.5
Restaino, D.6
Molis, S.7
-
18
-
-
0000424502
-
-
0003-6935, 10.1364/AO.25.001958
-
C. A. Mack, Appl. Opt. 0003-6935 25, 1958 (1986). 10.1364/AO.25.001958
-
(1986)
Appl. Opt.
, vol.25
, pp. 1958
-
-
MacK, C.A.1
-
19
-
-
0032148208
-
Adhesion and debonding of multi-layer thin film structures
-
DOI 10.1016/S0013-7944(98)00052-6, PII S0013794498000526
-
R. H. Dauskardt, M. Lane, Q. Ma, and N. Krishna, Eng. Fract. Mech. 0013-7944 61, 141 (1998). 10.1016/S0013-7944(98)00052-6 (Pubitemid 29111653)
-
(1998)
Engineering Fracture Mechanics
, vol.61
, Issue.1
, pp. 141-162
-
-
Dauskardt, R.H.1
Lane, M.2
Ma, Q.3
Krishna, N.4
-
20
-
-
0035239685
-
-
0884-2914, 10.1557/JMR.2001.0037
-
R. J. Hohlfelder, D. A. Maidenberg, R. H. Dauskardt, Y. Wei, and J. W. Hutchinson, J. Mater. Res. 0884-2914 16, 243 (2001). 10.1557/JMR.2001.0037
-
(2001)
J. Mater. Res.
, vol.16
, pp. 243
-
-
Hohlfelder, R.J.1
Maidenberg, D.A.2
Dauskardt, R.H.3
Wei, Y.4
Hutchinson, J.W.5
-
21
-
-
18444391842
-
-
0925-9635, 10.1016/j.diamond.2004.11.027
-
C. W. Chen, C. C. Haung, Y. Y. Lin, L. C. Chen, K. H. Chen, and W. F. Su, Diamond Relat. Mater. 0925-9635 14, 1010 (2005). 10.1016/j.diamond.2004.11.027
-
(2005)
Diamond Relat. Mater.
, vol.14
, pp. 1010
-
-
Chen, C.W.1
Haung, C.C.2
Lin, Y.Y.3
Chen, L.C.4
Chen, K.H.5
Su, W.F.6
-
22
-
-
32944463013
-
Photoconductivity and highly selective ultraviolet sensing features of amorphous silicon carbon nitride thin films
-
DOI 10.1063/1.2178406
-
C. W. Chen, C. C. Haung, Y. Y. Lin, W. F. Su, L. C. Chen, and K. H. Chen, Appl. Phys. Lett. 0003-6951 88, 073515 (2006). 10.1063/1.2178406 (Pubitemid 43261876)
-
(2006)
Applied Physics Letters
, vol.88
, Issue.7
, pp. 073515
-
-
Chen, C.-W.1
Huang, C.-C.2
Lin, Y.-Y.3
Su, W.-F.4
Chen, L.-C.5
Chen, K.-H.6
-
23
-
-
69249191369
-
-
0163-1918.
-
M. Tada, H. Yamamoto, F. Ito, M. Narihiro, M. Ueki, N. Inoue, M. Abe, S. Saito, T. Takeuchi, N. Furutake, T. Onodera, J. Kawahara, K. Arai, Y. Kasama, T. Taiji, M. Tohara, M. Sekine, and Y. Hayashi, Tech. Dig.-Int. Electron Devices Meet. 0163-1918 2006, 346781.
-
Tech. Dig. - Int. Electron Devices Meet.
, vol.2006
, pp. 346781
-
-
Tada, M.1
Yamamoto, H.2
Ito, F.3
Narihiro, M.4
Ueki, M.5
Inoue, N.6
Abe, M.7
Saito, S.8
Takeuchi, T.9
Furutake, N.10
Onodera, T.11
Kawahara, J.12
Arai, K.13
Kasama, Y.14
Taiji, T.15
Tohara, M.16
Sekine, M.17
Hayashi, Y.18
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