Adhesion quantification methods for wafer bonding

Materials Science and Engineering R: Reports

Volumn 50, Issue 4-5, 2005, Pages 109-165

  Vallin, Örjan ^a   Jonsson, Kerstin ^a   Lindberg, Ulf ^a  

^a UPPSALA UNIVERSITY   (Sweden)

Author keywords

Adhesion quantification; Blister; Bond strength; Brittle fracture; Chevron; Double cantilever beam; Fracture toughness; Surface energy; Tensile; Wafer bonding

Indexed keywords

INTERFACIAL ENERGY; MICROELECTROMECHANICAL DEVICES; OPTIMIZATION; PROCESS CONTROL;

ADHESION QUANTIFICATION; DOUBLE CANTILEVER BEAM; TENSILE; WAFER BONDING;

INTEGRATED CIRCUITS;

EID: 27144463115     PISSN: 0927796X     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.mser.2005.07.002     Document Type: Review

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