메뉴 건너뛰기




Volumn 82, Issue 1, 2000, Pages 239-244

Surface energy as a function of self-bias voltage in oxygen plasma wafer bonding

Author keywords

[No Author keywords available]

Indexed keywords

ANNEALING; BONDING; ELECTRIC POTENTIAL; INTERFACIAL ENERGY; PLASMA APPLICATIONS; SURFACE ROUGHNESS;

EID: 0033741540     PISSN: 09244247     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0924-4247(99)00338-6     Document Type: Article
Times cited : (43)

References (25)
  • 1
    • 0026911948 scopus 로고
    • A suggested mechanism for silicon direct bonding from studying hydrophilic and hydrophobic surfaces
    • Bäcklund Y., Ljungberg K., Söderberg A. A suggested mechanism for silicon direct bonding from studying hydrophilic and hydrophobic surfaces. J. Micromech. Microeng. 2:1992;158-160.
    • (1992) J. Micromech. Microeng. , vol.2 , pp. 158-160
    • Bäcklund, Y.1    Ljungberg, K.2    Söderberg, A.3
  • 2
    • 0028509792 scopus 로고
    • Effect of heat treatment on bonding properties in InP to Si direct wafer bonding
    • Wada H., Kamijoh T. Effect of heat treatment on bonding properties in InP to Si direct wafer bonding. Jpn. J. Appl. Phys. 33:1994;4878-4879.
    • (1994) Jpn. J. Appl. Phys. , vol.33 , pp. 4878-4879
    • Wada, H.1    Kamijoh, T.2
  • 3
    • 0027574861 scopus 로고
    • Void-free silicon-wafer-bond strengthening in the 200-400°C range
    • Kissinger G., Kissinger W. Void-free silicon-wafer-bond strengthening in the 200-400°C range. Sensors and Actuators, A (Physical), A. 36:1993;149-156.
    • (1993) Sensors and Actuators, a (Physical), a , vol.36 , pp. 149-156
    • Kissinger, G.1    Kissinger, W.2
  • 6
    • 0028413408 scopus 로고
    • Low temperature direct bonding of non-hydrophilic surfaces
    • Watt V.H.C., Bower R.W. Low temperature direct bonding of non-hydrophilic surfaces. Electron. Lett. 30:1994;693-695.
    • (1994) Electron. Lett. , vol.30 , pp. 693-695
    • Watt, V.H.C.1    Bower, R.W.2
  • 11
    • 0042137051 scopus 로고    scopus 로고
    • Low-temperature direct bonding of silicon and silicon dioxide by the surface activation method
    • Takagi H., Meada R., Chung T.R., Suga T. Low-temperature direct bonding of silicon and silicon dioxide by the surface activation method. Sensors and Actuators, A. 70:1998;164-170.
    • (1998) Sensors and Actuators, a , vol.70 , pp. 164-170
    • Takagi, H.1    Meada, R.2    Chung, T.R.3    Suga, T.4
  • 12
    • 0032188221 scopus 로고    scopus 로고
    • Low temperature silicon direct bonding for applications in micromechanics: Energies for different combinations of oxides
    • Kräuter G., Schumacher A., Gösele U. Low temperature silicon direct bonding for applications in micromechanics: energies for different combinations of oxides. Sensors and Actuators, A. 70:1998;271-275.
    • (1998) Sensors and Actuators, a , vol.70 , pp. 271-275
    • Kräuter, G.1    Schumacher, A.2    Gösele, U.3
  • 13
    • 0041636157 scopus 로고    scopus 로고
    • Wafer-to-wafer fusion bonding of oxidised silicon to silicon at low temperatures
    • Berthold A., Jakoby B., Vellekoop M.J. Wafer-to-wafer fusion bonding of oxidised silicon to silicon at low temperatures. Sensors and Actuators, A. 68:1998;410-413.
    • (1998) Sensors and Actuators, a , vol.68 , pp. 410-413
    • Berthold, A.1    Jakoby, B.2    Vellekoop, M.J.3
  • 18
    • 0031144619 scopus 로고    scopus 로고
    • Low temperature direct silicon wafer bonding using argon activation
    • Bower R., Chin F.Y.-J. Low temperature direct silicon wafer bonding using argon activation. Jpn. J. Appl. Phys. 36:1997;527-528.
    • (1997) Jpn. J. Appl. Phys. , vol.36 , pp. 527-528
    • Bower, R.1    Chin, F.Y.-J.2
  • 19
  • 20
    • 0026942799 scopus 로고
    • Water-enhanced debonding of room-temperature bonded silicon wafers for surface protection applications
    • Tong Q.-Y., Gafiteanu R., Gösele U. Water-enhanced debonding of room-temperature bonded silicon wafers for surface protection applications. Jpn. J. Appl. Phys. 31:1992;3483.
    • (1992) Jpn. J. Appl. Phys. , vol.31 , pp. 3483
    • Tong, Q.-Y.1    Gafiteanu, R.2    Gösele, U.3
  • 23
    • 0001158058 scopus 로고    scopus 로고
    • Oxidation rate and surface-potential variations of silicon during plasma oxidation
    • Kitajima M., Kamioka I., Nakamura K.G., Hishita S. Oxidation rate and surface-potential variations of silicon during plasma oxidation. Phys. Rev. B. 53:1996;3993.
    • (1996) Phys. Rev. B , vol.53 , pp. 3993
    • Kitajima, M.1    Kamioka, I.2    Nakamura, K.G.3    Hishita, S.4
  • 24
    • 0343121842 scopus 로고
    • A comparison of different methods for removal of damage caused by reactive sputter etching of silicon
    • Östling M., Petersson C.S., Norstron H., Buchta R., Blom H.O. A comparison of different methods for removal of damage caused by reactive sputter etching of silicon. J. Vac. Sci. Technol., B. 5:1987;586.
    • (1987) J. Vac. Sci. Technol., B , vol.5 , pp. 586
    • Östling, M.1    Petersson, C.S.2    Norstron, H.3    Buchta, R.4    Blom, H.O.5


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.