-
2
-
-
1542463273
-
Thermo-bimorph microcilia arrays for small spacecraft docking
-
ASME
-
J. Reiter, M. Terry, K. Bohringer, J. Suh and G. Kovacs, "Thermo-Bimorph Microcilia Arrays for Small Spacecraft Docking," MEMS-Vol. 2, Micro-Electro-Mechanical Systems (MEMS)-2000, ASME, 2000.
-
(2000)
Micro-Electro-Mechanical Systems (MEMS)-2000
, vol.MEMS-Vol. 2
-
-
Reiter, J.1
Terry, M.2
Bohringer, K.3
Suh, J.4
Kovacs, G.5
-
3
-
-
0004329593
-
CARES/Life ceramics analysis and reliability evaluation of structures life prediction program
-
NASA/TM-2003-106316, National Aeronautics and Space Administration
-
N. N. Nemeth, L. M. Powers, L. A. Janosik and J. P. Gykenyesi, "CARES/Life Ceramics Analysis and Reliability Evaluation of Structures Life Prediction Program," NASA/TM-2003-106316, National Aeronautics and Space Administration, 2003.
-
(2003)
-
-
Nemeth, N.N.1
Powers, L.M.2
Janosik, L.A.3
Gykenyesi, J.P.4
-
5
-
-
0003974580
-
Fracture of brittle materials under transient mechanical and thermal loading
-
U.S. Air Force Flight Dynamics Laboratory, AFFDL-TR-66-220 (NTIS AD-649978)
-
R. Barnett, C. Connors, P. Hermann and J. Wingfield, "Fracture of Brittle Materials Under Transient Mechanical and Thermal Loading," U.S. Air Force Flight Dynamics Laboratory, AFFDL-TR-66-220 (NTIS AD-649978), 1967.
-
(1967)
-
-
Barnett, R.1
Connors, C.2
Hermann, P.3
Wingfield, J.4
-
6
-
-
0000568853
-
Statistical approach to brittle fracture
-
edited by H. Liebowitz (Academic Press)
-
A. Freudenthal, "Statistical Approach to Brittle Fracture," Fracture, Vol. 2: An Advanced Treatise, Mathematical Fundamentals, edited by H. Liebowitz (Academic Press, 1968) p. 591.
-
(1968)
Fracture, Vol. 2: An Advanced Treatise, Mathematical Fundamentals
, pp. 591
-
-
Freudenthal, A.1
-
10
-
-
0030712716
-
Specimen size effect on tensile strength of surface-micromachined polycrystalline silicon thin films
-
T. Tsuchiya, O. Tabata, J. Sakata and Y. Taga, "Specimen Size Effect on Tensile Strength of Surface-Micromachined Polycrystalline Silicon Thin Films," in Proceedings of the Tenth Annual International Workshop on MEMS, 1997.
-
Proceedings of the Tenth Annual International Workshop on MEMS, 1997
-
-
Tsuchiya, T.1
Tabata, O.2
Sakata, J.3
Taga, Y.4
-
12
-
-
8844239192
-
Cross comparison of direct tensile testing techniques on polysilicon films
-
ASTM STP 1413, edited by C. Muhlstein and S. Brown, American Society for Testing and Materials
-
D. Lavan, T. Tsuchiya, G. Coles, W. Knauss, I. Chasiotis and D. Read, "Cross Comparison of Direct Tensile Testing Techniques on Polysilicon Films," Mechanical Properties of Structural Films, ASTM STP 1413, edited by C. Muhlstein and S. Brown, American Society for Testing and Materials, 2001.
-
(2001)
Mechanical Properties of Structural Films
-
-
Lavan, D.1
Tsuchiya, T.2
Coles, G.3
Knauss, W.4
Chasiotis, I.5
Read, D.6
-
13
-
-
8844254860
-
Tensile testing of thin films using electrostatic force grip
-
ASTM STP 1413, edited by C. Muhlstein and S. Brown, American Society for Testing and Materials
-
T. Tsuchiya and J. Sakata, "Tensile Testing of Thin Films Using Electrostatic Force Grip," Mechanical Properties of Structural Films, ASTM STP 1413, edited by C. Muhlstein and S. Brown, American Society for Testing and Materials, 2001.
-
(2001)
Mechanical Properties of Structural Films
-
-
Tsuchiya, T.1
Sakata, J.2
-
16
-
-
0035441291
-
-
W. Sharpe, Jr., K. Jackson, K. Hemker and Z. Zie, ibid. 10 (2001) 317.
-
(2001)
J. Microelectromech. Syst.
, vol.10
, pp. 317
-
-
Sharpe Jr., W.1
Jackson, K.2
Hemker, K.3
Zie, Z.4
-
17
-
-
8844252332
-
Direct tension and fracture toughness testing using the lateral force capabilities of a nanomechanical test system
-
ASTM STP 1413, edited by C. Muhlstein and S. Brown, American Society for Testing and Materials
-
D. Lavan, K. Jackson, B. McKenzie, S. Glass, T. Friedmann, J. Sullivan and T. Buchheit, "Direct Tension and Fracture Toughness Testing Using the Lateral Force Capabilities of a Nanomechanical Test System," Mechanical Properties of Structural Films, ASTM STP 1413, edited by C. Muhlstein and S. Brown, American Society for Testing and Materials, 2001.
-
(2001)
Mechanical Properties of Structural Films
-
-
Lavan, D.1
Jackson, K.2
McKenzie, B.3
Glass, S.4
Friedmann, T.5
Sullivan, J.6
Buchheit, T.7
-
18
-
-
0344201307
-
Strength testing and fractography of MEMS materials
-
Sandia No. 2000-0081C
-
S. Glass, D. Lavan, T. Buchheit and K. Jackson, "Strength Testing and Fractography of MEMS Materials," Sandia No. 2000-0081C.
-
-
-
Glass, S.1
Lavan, D.2
Buchheit, T.3
Jackson, K.4
-
19
-
-
0344633009
-
Strength testing and fractography MEMS materials
-
S. Glass, T. Buchheit and T. Friedmann, "Strength Testing and Fractography MEMS materials," Presented at the 103rd Annual Meeting of the American Ceramic Society, Indianapolis, Indiana, April 2000.
-
103rd Annual Meeting of the American Ceramic Society, Indianapolis, Indiana, April 2000
-
-
Glass, S.1
Buchheit, T.2
Friedmann, T.3
-
22
-
-
0344633007
-
Quasi-static and fatigue fracture strength of microsized silicon film measured by on-chip test method
-
T. Ando, T. Yshioka, M. Shikida and K. Sato, "Quasi-Static and Fatigue Fracture Strength of Microsized Silicon Film Measured by On-Chip Test Method," MEMS-Vol. 2, Micro-Electro-Mechanical Systems (MEMS)-2000 ASME, 2000, p. 1.
-
(2000)
MEMS-Vol. 2, Micro-Electro-Mechanical Systems (MEMS)-2000 ASME
, pp. 1
-
-
Ando, T.1
Yshioka, T.2
Shikida, M.3
Sato, K.4
-
28
-
-
0033343023
-
Statistical characterization of fracture of brittle MEMS materials
-
P. Jones, G. Johnson and R. Howe, "Statistical Characterization of Fracture of Brittle MEMS Materials," in Proceedings SPIE 3880, 2000, p. 20.
-
Proceedings SPIE 3880, 2000
, pp. 20
-
-
Jones, P.1
Johnson, G.2
Howe, R.3
-
29
-
-
0003548054
-
-
edited by C. Neughbauer, J. Newkirk and D. Vermilyea (John Wiley and Sons, Inc., New York)
-
J. Beams, in "Structure and Properties of Thin Films," edited by C. Neughbauer, J. Newkirk and D. Vermilyea (John Wiley and Sons, Inc., New York, 1959).
-
(1959)
Structure and Properties of Thin Films
-
-
Beams, J.1
-
31
-
-
85088327928
-
Verification of FEM analysis of load-deflection methods for measuring mechanical property of thin films
-
J.-Y. Pan, P. Lin, F. Maseeh and S. Senturia, "Verification of FEM Analysis of Load-Deflection Methods for Measuring Mechanical Property of Thin Films," Technical Digest, IEEE Solid-State Sensor and Actuator Workshop, Hilton-Head, SC, 1986.
-
Technical Digest, IEEE Solid-State Sensor and Actuator Workshop, Hilton-Head, SC, 1986
-
-
Pan, J.-Y.1
Lin, P.2
Maseeh, F.3
Senturia, S.4
-
32
-
-
0345063570
-
Characterization of mechanical properties of cubic silicon carbide thin films deposited onto silicon
-
Master of Science Thesis, Case Western Reserve University, Cleveland, OH
-
J. Mitchell, Characterization of Mechanical Properties of Cubic Silicon Carbide Thin Films Deposited Onto Silicon, Master of Science Thesis, Case Western Reserve University, Cleveland, OH, 2000.
-
(2000)
-
-
Mitchell, J.1
-
38
-
-
0012637901
-
-
C. Su, M. Wittig, A. Fekade and M. Spencer, ibid. 77(11) (1995) 5611.
-
(1995)
J. Appl. Phys.
, vol.77
, Issue.11
, pp. 5611
-
-
Su, C.1
Wittig, M.2
Fekade, A.3
Spencer, M.4
-
40
-
-
0344633005
-
Fracture toughness of SiC determined using nanoindentation
-
Information Literature from Instron Incorporated
-
D. Yang and T. Anderson, "Fracture Toughness of SiC Determined Using Nanoindentation," Information Literature from Instron Incorporated.
-
-
-
Yang, D.1
Anderson, T.2
-
41
-
-
24444457124
-
Film measurement system
-
FSM Frontier Semiconductor Measurement Inc.; 1631 North First Street, Suit 100, San Jose, CA 95117
-
FSM Frontier Semiconductor Measurement Inc., Film Measurement System, 1631 North First Street, Suit 100, San Jose, CA 95117.
-
-
-
-
42
-
-
0029517982
-
Properties of heteroepitaxial 3C-SiC films grown by LPCVD
-
Y. Yamaguchi, H. Nagasawa, T. Shoki and N. Annaka, "Properties of Heteroepitaxial 3C-SiC Films Grown by LPCVD," Transducers '95-Eurosensors IX, Stockholm, Sweden, June 25-29, 1995, p. 190.
-
Transducers '95-Eurosensors IX, Stockholm, Sweden, June 25-29, 1995
, pp. 190
-
-
Yamaguchi, Y.1
Nagasawa, H.2
Shoki, T.3
Annaka, N.4
-
50
-
-
0345063571
-
Mechanical properties of different polysilicons
-
W. Sharpe, Jr., K. Jackson, G. Coles and D. Lavan, "Mechanical Properties of Different Polysilicons," MEMS-Vol 2, Micro-Electro-Mechanical (MEMS)-2000, ASME, 2000.
-
(2000)
MEMS-Vol 2, Micro-Electro-Mechanical (MEMS)-2000, ASME
-
-
Sharpe Jr., W.1
Jackson, K.2
Coles, G.3
Lavan, D.4
-
52
-
-
33751128673
-
Comprehensive study of processing parameters influencing the stress and stress gradient of thick polysilicon layers
-
M. Furtsch, M. Offenberg, H. Muenzel and J. Morante, "Comprehensive Study of Processing Parameters Influencing the Stress and Stress Gradient of Thick Polysilicon Layers," in Proceedings of Micromaching Microfabrication Process Technology III, in Proceedings SPIE 3223, 1997, p. 130.
-
Proceedings of Micromaching Microfabrication Process Technology III, in Proceedings SPIE 3223, 1997
, pp. 130
-
-
Furtsch, M.1
Offenberg, M.2
Muenzel, H.3
Morante, J.4
-
56
-
-
0030718291
-
Materials reliability in MEMS devices
-
S. Brown, W. Arsdell and C. Muhlstein, "Materials Reliability in MEMS Devices," Transducers 1997, 1997 International Conference on Solid-State Sensors and Actuators, 1997.
-
Transducers 1997, 1997 International Conference on Solid-State Sensors and Actuators, 1997
-
-
Brown, S.1
Arsdell, W.2
Muhlstein, C.3
-
57
-
-
0031163708
-
-
C. Marxer, M. Gretillat, N. De Rooij, R. Battig, O. Anthamatten, B. Valk and P. Vogel, Sens. Actuators A61 (1997) 449.
-
(1997)
Sens. Actuators
, vol.A61
, pp. 449
-
-
Marxer, C.1
Gretillat, M.2
De Rooij, N.3
Battig, R.4
Anthamatten, O.5
Valk, B.6
Vogel, P.7
-
58
-
-
0002988797
-
The role of mechanics in microelectromechanical systems (MEMS) technology
-
AFRL-ML-WP-TR-1998-4209, Air Force Research Laboratory: Dayton, Ohio
-
R. Ballarini, The Role of Mechanics in Microelectromechanical Systems (MEMS) Technology, AFRL-ML-WP-TR-1998-4209, Air Force Research Laboratory: Dayton, Ohio, 1998.
-
(1998)
-
-
Ballarini, R.1
-
60
-
-
0036120882
-
Reliability of polysilicon under long-term cyclic loading
-
J. Bagdahn and W. N. Sharpe, Jr., "Reliability of Polysilicon Under Long-Term Cyclic Loading," 15th IEEE Int. Conf. on MEMS, January 20-24, Las Vegas, 2001, p. 447.
-
15th IEEE Int. Conf. on MEMS, January 20-24, Las Vegas, 2001
, pp. 447
-
-
Bagdahn, J.1
Sharpe Jr., W.N.2
-
61
-
-
0005360704
-
Subcritical crack growth in polysislicon MEMS
-
Ph.D. Dissertation, MIT, Cambridge, MA
-
W. Van Arsdell, Subcritical Crack Growth in Polysislicon MEMS, Ph.D. Dissertation, MIT, Cambridge, MA, 1997.
-
(1997)
-
-
Van Arsdell, W.1
-
62
-
-
0010974449
-
Fracture toughness of thin film polysilicon used in MEMS devices
-
K. Jackson, T. Buchheit and D. Lavan, "Fracture Toughness of Thin Film Polysilicon Used in MEMS Devices," in MEMS: Mechanics and Measurements, Society of Experimental Mechanics Symposium, 2001, p. 11.
-
MEMS: Mechanics and Measurements, Society of Experimental Mechanics Symposium, 2001
, pp. 11
-
-
Jackson, K.1
Buchheit, T.2
Lavan, D.3
-
64
-
-
0033749085
-
-
H. Kahn, N. Tayebi, R. Ballarini, R. Mullen and A. Heuer, Sens. Actuators 82 (2000) 274.
-
(2000)
Sens. Actuators
, vol.82
, pp. 274
-
-
Kahn, H.1
Tayebi, N.2
Ballarini, R.3
Mullen, R.4
Heuer, A.5
-
65
-
-
8844225612
-
Effects of microstructure on the strength and fracture toughness of polysilicon: A wafer level testing approach
-
ASTM STP 1413, edited by C. Muhlstein and S. Brown
-
R. Ballarini, H. Kahn, N. Tayebi and H. Heuer, "Effects of Microstructure on the Strength and Fracture Toughness of Polysilicon: A Wafer Level Testing Approach," Mechanical properties of Structural Films, ASTM STP 1413, edited by C. Muhlstein and S. Brown, 2001.
-
(2001)
Mechanical Properties of Structural Films
-
-
Ballarini, R.1
Kahn, H.2
Tayebi, N.3
Heuer, H.4
-
66
-
-
0035773923
-
Fracture toughness and fatigue investigations of polycrystalline
-
J. Bagdahn, J. Schischka, M. Petzold and W. N. Sharpe, Jr., "Fracture Toughness and Fatigue Investigations of Polycrystalline," in Proceedings of the SPIE 4558 (Reliability, Testing, and Characterization of MEMS/MOEMS), San Francisco, October 2001, p. 159.
-
Proceedings of the SPIE 4558 (Reliability, Testing, and Characterization of MEMS/MOEMS), San Francisco, October 2001
, pp. 159
-
-
Bagdahn, J.1
Schischka, J.2
Petzold, M.3
Sharpe Jr., W.N.4
-
67
-
-
0000586590
-
Advanced modeling of micromirror devices
-
A. Michalicek, D. Sene and V. Bright, "Advanced Modeling of Micromirror Devices," in international Conference on Integrated Micro/Nanotechnology for Space applications, 1995, p. 214.
-
International Conference on Integrated Micro/Nanotechnology for Space Applications, 1995
, pp. 214
-
-
Michalicek, A.1
Sene, D.2
Bright, V.3
-
69
-
-
34848834779
-
Mechanical properties of polysislicon between 0°C and 250°C
-
M. Eby, W. Sharpe and G. Coles, "Mechanical Properties of Polysislicon between 0°C and 250°C," in MEMS: Mechanics and Measurements, Society of Experimental Mechanics Symposium, Portland, Oregon, 2001, p. 16.
-
MEMS: Mechanics and Measurements, Society of Experimental Mechanics Symposium, Portland, Oregon, 2001
, pp. 16
-
-
Eby, M.1
Sharpe, W.2
Coles, G.3
-
70
-
-
0344209621
-
Measurement of thermal expansion coefficient of Poly-Si using microgauge sensors
-
J. Chae, J-Y. Lee and S. Kang, "Measurement of Thermal Expansion Coefficient of Poly-Si Using Microgauge Sensors," in Proceedings SPIE (1997) Vol. 3242, p. 202.
-
(1997)
Proceedings SPIE
, vol.3242
, pp. 202
-
-
Chae, J.1
Lee, J.-Y.2
Kang, S.3
-
72
-
-
0343867222
-
-
J. Kohler, K. Jonsson, S. Greek and L. Stenmark, J. Electrochem. Soc. 147(12) (2000) 4683.
-
(2000)
J. Electrochem. Soc.
, vol.147
, Issue.12
, pp. 4683
-
-
Kohler, J.1
Jonsson, K.2
Greek, S.3
Stenmark, L.4
-
74
-
-
0345063568
-
Behavior of MOEMS package (TI DMD) under mechanical and thermal loads
-
M. Variam, "Behavior of MOEMS Package (TI DMD) Under Mechanical and Thermal Loads," in MEMS-Vol 2, MEMS-ASME2000, 2000.
-
MEMS-Vol 2, MEMS-ASME2000, 2000
-
-
Variam, M.1
-
75
-
-
0344632999
-
Measurement of the local strength distribution of directly bonded silicon wafers using the micro-chevron-test
-
J. Bagdahn, A. Ploessl, M. Wiemer and M. Petzold, "Measurement of the Local Strength Distribution of Directly Bonded Silicon Wafers Using the Micro-Chevron-Test," in Proc. 5th International Symposium on Semiconductor Wafer Bonding, Electrochemical Society PV 99-35, 2001.
-
Proc. 5th International Symposium on Semiconductor Wafer Bonding, Electrochemical Society PV 99-35, 2001
-
-
Bagdahn, J.1
Ploessl, A.2
Wiemer, M.3
Petzold, M.4
-
76
-
-
0035774114
-
Strength assessment of wafer-bonded micromechanical components using the micro-chevron-test
-
M. Petzold, H. Knoll and J. Bagdahn, "Strength Assessment of Wafer-Bonded Micromechanical Components Using the Micro-Chevron-Test," in Proceedings of the SPIE 4558 (Reliability, Testing, and Characterization of MEMS/MOEMS), San Francisco, October 2001, p. 133.
-
Proceedings of the SPIE 4558 (Reliability, Testing, and Characterization of MEMS/MOEMS), San Francisco, October 2001
, pp. 133
-
-
Petzold, M.1
Knoll, H.2
Bagdahn, J.3
-
78
-
-
0345063567
-
Influence of frequency on the fatigue of directly wafer-bonded silicon
-
J. Bagdahn, M. Bernasch, and M. Petzold, "Influence of Frequency on the Fatigue of Directly Wafer-Bonded Silicon," 8th. Int. Congress on Fatigue, Stockholm, Sweden, 2002, p. 2245.
-
8th. Int. Congress on Fatigue, Stockholm, Sweden, 2002
, pp. 2245
-
-
Bagdahn, J.1
Bernasch, M.2
Petzold, M.3
-
81
-
-
0004441542
-
Silicon processing for the VLSI era
-
(Lattice Press, Sunset Beach, CA)
-
S. Wolf and R. Tauber, "Silicon Processing for the VLSI era," Process Technology, Vol. 1 (Lattice Press, Sunset Beach, CA, 1986) p. 5.
-
(1986)
Process Technology
, vol.1
, pp. 5
-
-
Wolf, S.1
Tauber, R.2
-
84
-
-
0003781076
-
Physical properties of crystals
-
Chapt. VIII (Clarendon Press, Oxford)
-
J. Nye, "Physical Properties of Crystals," Chapt. VIII (Clarendon Press, Oxford, 1957).
-
(1957)
-
-
Nye, J.1
-
92
-
-
0042638058
-
-
K. Sato, T. Yoshioka, T. Ando, M. Shikida and T. Kawabata, Sens. Actuators A 70 (1998) 148.
-
(1998)
Sens. Actuators A
, vol.70
, pp. 148
-
-
Sato, K.1
Yoshioka, T.2
Ando, T.3
Shikida, M.4
Kawabata, T.5
-
97
-
-
84987297810
-
The fracture of single-crystal silicon under several liquid environments
-
T.-J. Chen and W. Knapp, "The Fracture of Single-Crystal Silicon Under Several Liquid Environments," J. Amer. Ceram. Soc. 63 (1980) 225.
-
(1980)
J. Amer. Ceram. Soc.
, vol.63
, pp. 225
-
-
Chen, T.-J.1
Knapp, W.2
-
102
-
-
0031011708
-
Macro power from micro machinery
-
A. Epstein and S. Senturia, "Macro Power From Micro Machinery," Science 276(5316) (1997) 1211.
-
(1997)
Science
, vol.276
, Issue.5316
, pp. 1211
-
-
Epstein, A.1
Senturia, S.2
-
105
-
-
0345063562
-
-
Ph.D. Thesis, Massachusetts Institute of Technology
-
K.-S. Chen, Ph.D. Thesis, Massachusetts Institute of Technology, 1999.
-
(1999)
-
-
Chen, K.-S.1
-
106
-
-
0345063559
-
Mechanical properties of silicon nitride
-
G. Coles, W. Sharpe, Jr. and R. Edwards, "Mechanical Properties of Silicon Nitride," MEMS-Vol 2, Micro-Electro-Mechanical (MEMS)-2000, ASME 2000 (2000) p. 1.
-
(2000)
MEMS-Vol 2, Micro-Electro-Mechanical (MEMS)-2000, ASME 2000
, pp. 1
-
-
Coles, G.1
Sharpe Jr., W.2
Edwards, R.3
-
107
-
-
0030392559
-
New test structures and techniques for measurement of mechanical properties of MEMS materials
-
W. Sharpe, Jr., "New Test Structures and Techniques for Measurement of Mechanical Properties of MEMS Materials," in Proceedings of the SPIE Symposium on Microlithography and Metrology in Micromachining II, Austin, TX, 1996, p. 78.
-
Proceedings of the SPIE Symposium on Microlithography and Metrology in Micromachining II, Austin, TX, 1996
, pp. 78
-
-
Sharpe Jr., W.1
-
109
-
-
0033719568
-
-
T.-Y. Zhang, Y.-J. Su, C.-F. Qian, M.-H. Hao and L.-Q. Chen, Acta Mater. 48 (2000) 2843.
-
(2000)
Acta Mater.
, vol.48
, pp. 2843
-
-
Zhang, T.-Y.1
Su, Y.-J.2
Qian, C.-F.3
Hao, M.-H.4
Chen, L.-Q.5
-
112
-
-
0345063563
-
-
E. Bromley, J. Randall, D. Flanders and R. Mountain, J. Vacuum Sci. Techn. B1(4) (1983) 1364.
-
(1983)
J. Vacuum Sci. Techn.
, vol.B1
, Issue.1
, pp. 1364
-
-
Bromley, E.1
Randall, J.2
Flanders, D.3
Mountain, R.4
-
113
-
-
0242669155
-
Structural modeling and probabilistic characterization of MEMS pressure sensor membranes
-
N. Nemeth, O. Jadaan, J. Palko, J. Mitchell and C. Zorman, "Structural Modeling and Probabilistic Characterization of MEMS Pressure Sensor Membranes," in MEMS: Mechanics and Measurements, Society of Experimental Mechanics Symposium, Portland, Oregon, 2001, p. 46.
-
MEMS: Mechanics and Measurements, Society of Experimental Mechanics Symposium, Portland, Oregon, 2001
, pp. 46
-
-
Nemeth, N.1
Jadaan, O.2
Palko, J.3
Mitchell, J.4
Zorman, C.5
-
118
-
-
1642307384
-
Mechanical properties of 3C thin-film silicon carbide
-
K. Jackson, G. Dirras, R. Edwards and W. Sharpe, Jr., "Mechanical Properties of 3C Thin-Film Silicon Carbide," in Proceedings of the 2002 SEM Annual Conference, Milwaukee, 2002, p. 99.
-
Proceedings of the 2002 SEM Annual Conference, Milwaukee, 2002
, pp. 99
-
-
Jackson, K.1
Dirras, G.2
Edwards, R.3
Sharpe Jr., W.4
|