Strength and leak testing of plasma activated bonded interfaces

Sensors and Actuators, A: Physical

Volumn 97-98, Issue , 2002, Pages 434-440

  Visser, M M ^a   Weichel, S ^b,c   De Reus, R ^b,c   Hanneborg, A B ^a  

^a SINTEF   (Norway)

^b Grundfos DK AS   (Denmark)

^c TECHNICAL UNIVERSITY OF DENMARK   (Denmark)

Author keywords

Bond strength; Hermeticity; Oxygen plasma; PAB; Water bonding

Indexed keywords

ACETONE; BOND STRENGTH (MATERIALS); CLEANING; FRACTURE; INTERFACES (MATERIALS); INTERFACIAL ENERGY; OXYGEN; PLASMA APPLICATIONS; SILICA; SOLDERING; VACUUM APPLICATIONS; WATER;

DEIONIZED WATER; HERMITICITY; LEAK TESTING; PLASMA ACTIVATED BONDED INTERFACES;

SILICON WAFERS;

EID: 0011868622     PISSN: 09244247     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0924-4247(02)00047-X     Document Type: Conference Paper

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