Low temperature bonding of ceramics by sol-gel processing

Journal of Sol-Gel Science and Technology

Volumn 19, Issue 1-3, 2000, Pages 321-324

  Barbe C J ^a   Cassidy, D J ^a   Triani, G ^a   Latella, B A ^a   Mitchell, D R G ^a   Finnie, K S ^a   Bartlett, J R ^a   Woolfrey, J L ^a   Collins, G A ^a  

^a AUSTRALIAN NUCLEAR SCIENCE AND TECHNOLOGY ORGANISATION   (Australia)

Author keywords

[No Author keywords available]

Indexed keywords

BONDING; CRYSTAL MICROSTRUCTURE; DIFFERENTIAL THERMAL ANALYSIS; ELLIPSOMETRY; FIRING (OF MATERIALS); FOURIER TRANSFORM INFRARED SPECTROSCOPY; HYDROLYSIS; INTERFACIAL ENERGY; LOW TEMPERATURE EFFECTS; SOL-GELS; SPIN COATING; THERMOGRAVIMETRIC ANALYSIS;

HYDROLYSED SILICON ALKOXIDES; INTERFACIAL FRACTURE ENERGY; LOW TEMPERATURE BONDING; MICROINDENTATION; SOL-GEL CHEMISTRY; SOL-GEL PROCESSING;

CERAMIC MATERIALS;

EID: 0034478586     PISSN: 09280707     EISSN: None     Source Type: Journal    
DOI: 10.1023/A:1008733632163     Document Type: Article

References (4)

1. J. Steinkirchner, T. Martini, M. Reiche, G. Küstner, and U. Gösele, Advanced Materials 7, 662 (1995).
2. W. Kern and D. Puotinen, RCA Review June 1970, p. 187.
3. C.J. Brinker and G.W. Scherer, Sol-Gel Science: The Physics and Chemistry of Sol-Gel Processing (Academic Press, San Diego, 1990), p. 212.
4. C.J. Brinker and G.W. Scherer, Sol-Gel Science: The Physics and Chemistry of Sol-Gel Processing (Academic Press, San Diego, 1990), p. 799.