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Volumn 82, Issue 1, 2000, Pages 224-228
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Glass-to-glass anodic bonding with standard IC technology thin films as intermediate layers
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Author keywords
[No Author keywords available]
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Indexed keywords
GLASS BONDING;
THIN FILMS;
GLASS-TO-GLASS ANODIC BONDING;
INTEGRATED CIRCUIT MANUFACTURE;
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EID: 0033751490
PISSN: 09244247
EISSN: None
Source Type: Journal
DOI: 10.1016/S0924-4247(99)00376-3 Document Type: Article |
Times cited : (99)
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References (6)
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