New multichip-on-silicon packaging scheme for microsystems

Sensors and Actuators, A: Physical

Volumn 52, Issue 1-3, 1996, Pages 156-160

  Guérin, Louis ^a   Schaer, Marc Antoine ^a   Sachot, Rémy ^a   Dutoit, Michel ^a  

^a EPFL   (Switzerland)

Author keywords

Low temperature bonding; Multichip on silicon; Optoelectronic microsystems; Passive component integration

Indexed keywords

INTEGRATED CIRCUIT LAYOUT; MICROELECTROMECHANICAL DEVICES; MICROELECTRONIC PROCESSING; MICROELECTRONICS; MULTICHIP MODULES; OPTOELECTRONIC DEVICES;

MULTICHIP ON SILICON PACKAGING; OPTOELECTRONIC MICROSYSTEMS; PASSIVE COMPONENT INTEGRATION;

ELECTRONICS PACKAGING;

EID: 0030102259     PISSN: 09244247     EISSN: None     Source Type: Journal    
DOI: 10.1016/0924-4247(96)80142-7     Document Type: Article

References (7)

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