Wafer-to-wafer fusion bonding of oxidized silicon to silicon at low temperatures

Sensors and Actuators, A: Physical

Volumn 68, Issue 1-3, 1998, Pages 410-413

  Berthold, Axel ^a   Jakoby, Bernard ^a   Vellekoop, Michael J ^a  

^a DELFT UNIVERSITY OF TECHNOLOGY   (Netherlands)

Author keywords

Fusion bonding; Low temperature bonding; Oxide to silicon bonding

Indexed keywords

BOND STRENGTH (MATERIALS); BONDING; ELECTRIC INSULATION; LOW TEMPERATURE OPERATIONS; SILICA; SURFACE TREATMENT;

FUSION BONDING; LOW TEMPERATURE BONDING; OXIDE TO SILICON BONDING;

SILICON WAFERS;

EID: 0041636157     PISSN: 09244247     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0924-4247(98)00028-4     Document Type: Article

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