Bond-quality characterization of silicon-glass anodic bonding

Sensors and Actuators, A: Physical

Volumn 60, Issue 1-3, 1997, Pages 223-227

  Tatic Lucic, Svetlana ^a   Ames, John ^a   Boardman, Bill ^a   McIntyre, David ^a,c   Jaramillo, Paul ^a   Starr, Larry E ^a   Lim, Myoungho ^b  

^a Ford Microelectronics Inc   (United States)

^b University of Colorado Colorado Springs   (United States)

^c WinStar Inc   (United States)

Author keywords

Anodic bonding; Bond quality; Glass; Silicon

Indexed keywords

BOND STRENGTH (MATERIALS); GLASS; OPTIMIZATION; SILICON; TESTING;

ANODIC BONDING; BOND QUALITY; PHOSPHOSILICATE GLASS;

GLASS BONDING;

EID: 0031142819     PISSN: 09244247     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0924-4247(97)01381-2     Document Type: Article

References (8)

1. T. Rogers and J. Kowal, Selection of glass, anodic bonding conditions and material compatibility for silicon-glass capacitive sensors, Sensors and Actuators A, 46-47 (1995) 113-120.
2. L. Spangler and C. Kemp, ISAAC - integrated silicon automotive accelerometer, Sensors and Actuators A, 54 (1996) 523-529.
3. E. Obermeier, Anodic wafer bonding, Proc. 3rd Int. Symp. Semiconductor Wafer Bonding: Physics and Applications, Reno, NV, USA, 21-26 May, 1995, pp, 212-220.
4. W. Maszara, B.-L. Jiang, A. Yamada, G.A. Rozgonyi, H. Baumgart and A.J.R. de Kock, Role of surface morphology in wafer bonding, J. Appl. Phys., 69 (1991) 257-260.
5. R.D. Horning, D.W. Burns and A.I. Aikwande, A test structure for bond strength measurement and process diagnostics, Proc. 1st Int. Symp. Semiconductor Wafer Bonding: Science, Technology, and Applications, Phoenix, AZ, USA, 13-18 Oct., 1992, Vol. 92-7, 1992, pp. 386-393.
6. V. Lehmann, K. Mitani and R. Stengl, Bubble-free wafer bonding of GaAs and InP on silicon in a micro-cleanroom, Jpn. J. Appl. Phys., 28 (1989) L2141.
7. D.M. Thouless, Fracture mechanics for thin-film adhesion, IBM J. Res. Develop., 38 (1994) 367-377.
8. D.M. Montgomery, Design and Analysis of Experiments, John Wiley, New York, 1991.