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Volumn 26, Issue 1-3, 2003, Pages 1145-1150

Low temperature bonding of ceramics by sol-gel processing

Author keywords

Acrylates; Alumina; Ceramic bonding; Silica; Thin films

Indexed keywords

ALUMINA; ATOMIC FORCE MICROSCOPY; BOND STRENGTH (MATERIALS); BONDING; CERAMIC MATERIALS; ELLIPSOMETRY; HYDROLYSIS; INDENTATION; POLYCRYSTALLINE MATERIALS; SILICON WAFERS; SPIN COATING; TENSILE TESTING; THERMAL EFFECTS; THIN FILMS; TRANSMISSION ELECTRON MICROSCOPY;

EID: 0037272083     PISSN: 09280707     EISSN: None     Source Type: Journal    
DOI: 10.1023/A:1020779328624     Document Type: Conference Paper
Times cited : (9)

References (10)


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.