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Volumn 26, Issue 1-3, 2003, Pages 1145-1150
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Low temperature bonding of ceramics by sol-gel processing
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Author keywords
Acrylates; Alumina; Ceramic bonding; Silica; Thin films
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Indexed keywords
ALUMINA;
ATOMIC FORCE MICROSCOPY;
BOND STRENGTH (MATERIALS);
BONDING;
CERAMIC MATERIALS;
ELLIPSOMETRY;
HYDROLYSIS;
INDENTATION;
POLYCRYSTALLINE MATERIALS;
SILICON WAFERS;
SPIN COATING;
TENSILE TESTING;
THERMAL EFFECTS;
THIN FILMS;
TRANSMISSION ELECTRON MICROSCOPY;
POLYCRYSTALLINE WAFERS;
SOL-GELS;
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EID: 0037272083
PISSN: 09280707
EISSN: None
Source Type: Journal
DOI: 10.1023/A:1020779328624 Document Type: Conference Paper |
Times cited : (9)
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References (10)
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