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Journal of the Electrochemical Society

Volumn 145, Issue 4, 1998, Pages 1360-1362

Low temperature silicon wafer-to-wafer bonding with nickel silicide

(7) Xiao, Zhi Xiong a Wu, Guo Ying a Zhang, Guo Bing a Li, Zhi Hong a Hao, Yi Long a Chen, Wen Ru a Wang, Yang Yuan a,b

a PEKING UNIVERSITY (China)

b ELECTROCHEMICAL SOCIETY

Author keywords

[No Author keywords available]

Indexed keywords

ADHESION; ANNEALING; AUGER ELECTRON SPECTROSCOPY; BONDING; INTERFACES (MATERIALS); NICKEL COMPOUNDS; SCANNING ELECTRON MICROSCOPY; TENSILE STRENGTH; TENSILE TESTING; ULTRASONIC APPLICATIONS; X RAY DIFFRACTION ANALYSIS;

NICKEL SILICIDES;

SILICON WAFERS;

EID: 0032046233 PISSN: 00134651 EISSN: None Source Type: Journal
DOI: 10.1149/1.1838466 Document Type: Article

Times cited : (7)

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