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Volumn 32, Issue 4 SUPPL., 1998, Pages

Direct wafer bonding : A new method for ferroelectric-silicon heterostructure fabrication

Author keywords

[No Author keywords available]

Indexed keywords

EID: 0032396504 PISSN: 03744884 EISSN: None Source Type: Journal
DOI: None Document Type: Article

Times cited : (2)

References (17)

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