Modification of silicon surfaces with H2SO4:H2O2:HF and HNO3:HF for wafer bonding applications

Journal of the Electrochemical Society

Volumn 143, Issue 5, 1996, Pages 1709-1714

  Ljungberg, Karin ^a   Jansson, Ulf ^a   Bengtsson, Stefan ^b   Söderbärg, Anders ^a  

^a UPPSALA UNIVERSITY   (Sweden)

^b CHALMERS UNIVERSITY OF TECHNOLOGY   (Sweden)

Author keywords

[No Author keywords available]

Indexed keywords

AGENTS; BONDING; COMPOSITION; ETCHING; HYDROGEN INORGANIC COMPOUNDS; HYDROGEN PEROXIDE; HYDROGEN SULFIDE; MIXTURES; OXIDATION; SURFACE CLEANING; SURFACE TREATMENT; X RAY PHOTOELECTRON SPECTROSCOPY;

HYDROGEN FLUORIDE; HYDROGEN NITRIDE; HYDROGEN TERMINATED SURFACES;

SILICON WAFERS;

EID: 0030149643     PISSN: 00134651     EISSN: None     Source Type: Journal    
DOI: 10.1149/1.1836705     Document Type: Article

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