Metal bonding during sputter film deposition

Journal of Vacuum Science and Technology A: Vacuum, Surfaces and Films

Volumn 16, Issue 4, 1998, Pages 2125-2131

  Shimatsu, T ^a,b   Mollema, R H ^a   Monsma, D ^a   Keim, E G ^a,c   Lodder, J C ^a  

^a UNIVERSITY OF TWENTE   (Netherlands)

^b TOHOKU UNIVERSITY   (Japan)

^c Center for Materials Research

Author keywords

[No Author keywords available]

Indexed keywords

EID: 0032330535     PISSN: 07342101     EISSN: None     Source Type: Journal    
DOI: 10.1116/1.581319     Document Type: Article

References (20)

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