Mechanically induced Si layer transfer in hydrogen-implanted Si wafers

Applied Physics Letters

Volumn 76, Issue 17, 2000, Pages 2370-2372

  Henttinen, K ^a   Suni, I ^a   Lau, S S ^b  

^a VTT TECHNICAL RESEARCH CENTRE OF FINLAND   (Finland)

^b UNIVERSITY OF CALIFORNIA   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

EID: 0000372949     PISSN: 00036951     EISSN: None     Source Type: Journal    
DOI: 10.1063/1.126349     Document Type: Article

References (5)

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3. U. Gösele, Semiconductor Wafer Bonding, Electrochemical Society Series (Wiley, New York 1999), p. 66.
4. S. N. Farrens, J. R. Dekker, J. K. Smith and B. E. Roberts, J. Electrochem. Soc. 142, 3949 (1995).
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