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Journal of Micromechanics and Microengineering

Volumn 11, Issue 4, 2001, Pages 364-370

Oxygen plasma wafer bonding evaluated by the Weibull fracture probability method

(4) Jonsson, K a Kohler J a Hedlund, C a Stenmark, L a

a UPPSALA UNIVERSITY (Sweden)

Author keywords

[No Author keywords available]

Indexed keywords

ANNEALING; BONDING; CHEMICAL ACTIVATION; FRACTURE; INTERFACES (MATERIALS); INTERFACIAL ENERGY; MICROCRACKS; MICROSTRUCTURE; OXYGEN; PLASMA APPLICATIONS; STATISTICAL METHODS; STRESS CONCENTRATION; WEIBULL DISTRIBUTION;

WEIBULL FRACTURE PROBABILITY METHOD;

SILICON WAFERS;

EID: 0035397307 PISSN: 09601317 EISSN: None Source Type: Journal
DOI: 10.1088/0960-1317/11/4/314 Document Type: Article

Times cited : (13)

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