Double-sided bulk micromachining of silicon-on-insulator films using room-temperature oxygen plasma assisted bonding

Journal of Micromechanics and Microengineering

Volumn 12, Issue 6, 2002, Pages 786-794

  Sanz Velasco, Anke ^a   Rödjegård, Henrik ^b   Andersson, Gert I ^b  

^a CHALMERS UNIVERSITY OF TECHNOLOGY   (Sweden)

^b Imego AB The Institute of Micro and Nanotechnology   (Sweden)

Author keywords

[No Author keywords available]

Indexed keywords

AMMONIUM COMPOUNDS; CMOS INTEGRATED CIRCUITS; ETCHING; INTEGRATED CIRCUIT MANUFACTURE; LITHOGRAPHY; MICROELECTROMECHANICAL DEVICES; OXYGEN; PLASMA APPLICATIONS; SEMICONDUCTING FILMS; SILICON ON INSULATOR TECHNOLOGY; SILICON WAFERS;

OXYGEN PLASMA ASSISTED WAFER BONDING; TETRAMETHYL AMMONIUM HYDROXIDE;

BONDING;

EID: 0036851992     PISSN: 09601317     EISSN: None     Source Type: Journal    
DOI: 10.1088/0960-1317/12/6/310     Document Type: Article

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