Low temperature wafer bonding for thin silicon film transfer

Sensors and Actuators, A: Physical

Volumn 110, Issue 1-3, 2004, Pages 401-406

  Goustouridis, D ^a   Minoglou, K ^a   Kolliopoulou, S ^a   Chatzandroulis, S ^a   Morfouli, P ^b   Normand, P ^a   Tsoukalas, D ^a,c  

^a INSTITUTE OF MICROELECTRONICS   (Greece)

^b Grenoble INP Phelma   (France)

^c NATIONAL TECHNICAL UNIVERSITY OF ATHENS   (Greece)

Author keywords

Bond strength; Low temperature bonding; Plasma activation; Silicon wafer bonding; Silicon on insulator (SOI)

Indexed keywords

LOW TEMPERATURE BONDING; PLASMA ACTIVATION;

BOND STRENGTH (CHEMICAL); CHEMICAL ACTIVATION; CHEMICAL BONDS; ELECTRONICS PACKAGING; LOW TEMPERATURE EFFECTS; NETWORKS (CIRCUITS); SILICON ON INSULATOR TECHNOLOGY; SILICON WAFERS;

THIN FILMS;

EID: 1642525630     PISSN: 09244247     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.sna.2003.09.011     Document Type: Conference Paper

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