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Volumn 29, Issue 7, 2000, Pages 909-915

Room temperature wafer bonding of silicon, oxidized silicon, and crystalline quartz

Author keywords

[No Author keywords available]

Indexed keywords

ANNEALING; ARGON; BONDING; CHEMICAL ACTIVATION; ELECTRIC VARIABLES MEASUREMENT; INTERFACIAL ENERGY; OXYGEN; PLASMAS; SILICA; TEMPERATURE;

EID: 0034230008     PISSN: 03615235     EISSN: None     Source Type: Journal    
DOI: 10.1007/s11664-000-0180-7     Document Type: Article
Times cited : (39)

References (17)
  • 5
    • 63149142345 scopus 로고    scopus 로고
    • ed. U. Gösele, H. Baumgart, T. Abe, C. Hunt, and S. Iyer Pennington, NJ: Electrochem. Soc.
    • S.N. Farrens, Semiconductor Wafer Bonding IV, ed. U. Gösele, H. Baumgart, T. Abe, C. Hunt, and S. Iyer (Pennington, NJ: Electrochem. Soc., 1997), p. 425.
    • (1997) Semiconductor Wafer Bonding IV , vol.4 , pp. 425
    • Farrens, S.N.1
  • 6
    • 31844438252 scopus 로고    scopus 로고
    • ed. U. Gösele, H. Baumgart, T. Abe, C. Hunt, and S. Iyer Pennington, NJ: Electrochem. Soc.
    • M. Reiche, K. Gutjahr, D. Stolze, D. Burczyk, and M. Petzold, Semiconductor Wafer Bonding IV, ed. U. Gösele, H. Baumgart, T. Abe, C. Hunt, and S. Iyer (Pennington, NJ: Electrochem. Soc., 1997), p. 437.
    • (1997) Semiconductor Wafer Bonding IV , vol.4 , pp. 437
    • Reiche, M.1    Gutjahr, K.2    Stolze, D.3    Burczyk, D.4    Petzold, M.5
  • 7
    • 0005903127 scopus 로고
    • ed. C. Hunt, H. Baumgart, S.S. Iyer, T. Abe, and, U. Gösele Pennington, NJ: Electrochem. Soc.
    • S. Farrens and J. Smith, Semiconductor Wafer Bonding III, ed. C. Hunt, H. Baumgart, S.S. Iyer, T. Abe, and, U. Gösele (Pennington, NJ: Electrochem. Soc., 1995), p. 72.
    • (1995) Semiconductor Wafer Bonding III , vol.3 , pp. 72
    • Farrens, S.1    Smith, J.2
  • 9
    • 0009051035 scopus 로고    scopus 로고
    • ed. U. Gösele, H. Baumgart, T. Abe, C. Hunt, and S. Iyer Pennington, NJ: Electrochem. Soc.
    • B.E. Roberds and S.N Farrens, Semiconductor Wafer Bonding IV, ed. U. Gösele, H. Baumgart, T. Abe, C. Hunt, and S. Iyer (Pennington, NJ: Electrochem. Soc., 1997), p. 598.
    • (1997) Semiconductor Wafer Bonding IV , vol.4 , pp. 598
    • Roberds, B.E.1    Farrens, S.N.2


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.